Freescale Semiconductor MPX4250A

Technical Data Rev 6, 12/2006

Integrated Silicon Pressure Sensor MPX4250A

Manifold Absolute Pressure Sensor MPXA4250A
On-Chip Signal Conditioned, SERIES
Temperature Compensated
and Calibrated INTEGRATED
PRESSURE SENSOR
The MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP) 20 TO 250 kPA (2.9 TO 36.3 psi)
sensor for engine control is designed to sense absolute air pressure within the 0.2 TO 4.9 V OUTPUT
intake manifold. This measurement can be used to compute the amount of fuel
required for each cylinder.
The MPX4250A/MPXA4250A series piezoresistive transducer is a state-of- SMALL OUTLINE PACKAGES
the-art monolithic silicon pressure sensor designed for a wide range of
applications, particularly those employing a microcontroller or microprocessor
with A/D inputs. This transducer combines advanced micromachining
techniques, thin-film metallization and bipolar processing to provide an accurate,
high-level analog output signal that is proportional to the applied pressure. The
small form factor and high reliability of on-chip integration make the Freescale
sensor a logical and economical choice for the automotive system engineer. MPXA4250A6U/6T1 MPXA4250AC6U/C6T1
CASE 482-01 CASE 482A-01
Features
• 1.5% Maximum Error Over 0° to 85°C SMALL OUTLINE PACKAGE
• Specifically Designed for Intake Manifold Absolute Pressure Sensing in PIN NUMBERS
Engine Control Systems 1 N/C(1), (2) 5(2) N/C
• Patented Silicon Shear Stress Strain Gauge 2 VS 6 (2) N/C
• Temperature Compensated Over -40° to +125°C 3 GND (2) N/C
7
• Offers Reduction in Weight and Volume Compared to Existing Hybrid
4 VOUT 8 N/C
Modules
• Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface 1. Pin 1 in noted by the notch in the lead.
Mount Package 2. Pins 1, 5, 6, and 7 are internal device
connections. Do not connect to external
• Ideal for Non-Automotive Applications circuitry or ground.
Typical Applications UNIBODY PACKAGES
• Turbo Boost Engine Control
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
ORDERING INFORMATION
Device MPX Series Packing Device
Options Case No.
Type Order Number Options Marking MPX4250A
SMALL OUTLINE PACKAGE(1) (MPXA4250A SERIES) CASE 867-08
Basic Absolute, Element Only 482 MPXA4250A6U Rails MPXA4250A
Elements 482 MPXA4250A6T1 Tape & Reel MPXA4250A MPX4250AP
Ported Absolute, Axial Port 482A MPXA4250AC6U Rails MPXA4250A CASE 867B-04
Elements 482A MPXA4250AC6T1 Tape & Reel MPXA4250A
UNIBODY PACKAGE(2) (MPX4250A SERIES) UNIBODY PACKAGE PIN NUMBERS
Basic Absolute, Element Only 867 MPX4250A — MPX4250A 1 4
Element
VOUT(1) N/C(2)
Ported Absolute, Ported 867B MPX4250AP — MPX4250AP 2 GND 5 N/C(2)
Elements
3 VS 6 N/C(2)
1. The MPXA4250A series pressure sensors are available in the basic element package
or with pressure port fitting. Two packing options are offered for each type. 1. Pin 1 in noted by the notch in the lead.
2. The MPX4250A series pressure sensors are available in the basic element package 2. Pins 4, 5, and 6 are internal device
or with pressure port fittings providing mounting ease and barbed hose connections. connections. Do not connect to external
circuitry or ground.

© Freescale Semiconductor, Inc., 2006. All rights reserved.

 VS

Thin Film Gain Stage #2

Temperature and
Sensing Ground
Compensation VOUT
Element Reference
and
Gain Stage #1 Shift Circuitry

Pins 4, 5, and 6 are NO CONNECTS for unibody Device

GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings(1)

Rating Symbol Value Unit

Maximum Pressure(2) (P1 > P2) PMAX 1000 kPa

Storage Temperature TSTG -40 to +125 °C

Operating Temperature TA -40 to +125 °C

1. TC = 25°C unless otherwise noted.

2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

MPX4250A
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2 Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 VDC, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in
Figure 3 required to meet electrical specifications.)

Characteristic Symbol Min Typ Max Units

Differential Pressure Range(1) POP 20 — 250 kPa

Supply Voltage(2) VS 4.85 5.1 5.35 VDC

Supply Current IO — 7.0 10 mAdc

Minimum Pressure Offset(3) (0 to 85°C) VOFF 0.133 0.204 0.264 VDC

@ VS = 5.1 Volts

Full Scale Output(4) (0 to 85°C) VFSO 4.826 4.896 4.966 VDC

@ VS = 5.1 Volts

Full Scale Span(5) (0 to 85°C) VFSS — 4.692 — VDC

@ VS = 5.1 Volts

Accuracy(6) (0 to 85°C) — — — ±1.5 %VFSS

Sensitivity ∆V/∆Ρ — 20 — mV/kPa

Response Time(7) tR — 1.0 — msec

Output Source Current at Full Scale Output IO + — 0.1 — mAdc

Warm-Up Time(8) — — 20 — msec

Offset Stability(9) — — ±0.5 — %VFSS

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range.
3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity: Output deviation at any temperature from a straight line relationship with pressure over the specified pressure
range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected
to a specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

Table 3. Mechanical Characteristics

Characteristics Typ Unit

Weight, Basic Element (Case 867) 4.0 Grams

Weight, Small Outline Package (Case 482) 1.5 Grams

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 +5 V
FloroSilicone Stainless Steel
Die Coat Metal Cover
Die OUTPUT
P1 Vout
Epoxy Vs
Wire Bond
Case
IPS

RTV Die 1.0 µF 0.01 µF GND 470 pF

Lead Frame P2 Bond
Sealed Vacuum Reference

Figure 3. Recommended Power Supply Decoupling and

Output Filtering
Figure 2. Cross Sectional Diagram (Not to Scale) (For additional output filtering, please refer to Application
Note AN1646.
Figure 2 illustrates the absolute pressure sensing chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates Contact the factory for information regarding media
the die surface and wire bonds from the environment, while compatibility in your application.
allowing the pressure signal to be transmitted to the sensor Figure 3 shows the recommended decoupling circuit for
diaphragm. interfacing the output of the integrated sensor to the A/D input
The MPX4250A/MPXA4250A series pressure sensor of a microprocessor or microcontroller.
operating characteristics and internal reliability and Figure 4 shows the sensor output signal relative to
qualification tests are based on use of dry air as the pressure pressure input. Typical, minimum, and maximum output
media. Media, other than dry air, may have adverse effects on curves are shown for operation over temperature range of 0°
sensor performance and long-term reliability. to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.

5.0
Transfer Function: MAX
4.5
VOUT = Vs* (0.004 x P-0.04) ± Error
4.0
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
TYP
3.0
Output (Volts)

2.5
2.0
1.5
1.0 MIN
0.5
0
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260

Pressure (ref: to sealed vacuum) in kPa

Figure 4. Output vs. Absolute Pressure

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 Transfer Function
Nominal Transfer Value: VOUT = VS (P × 0.004 - 0.04)
± (Pressure Error × Temp. Factor × 0.004 × VS)
VS = 5.1 V ± 0.25 VDC

Temperature Error Band

4.0

Temp Multiplier
3.0
- 40 3
Temperature 0 to 85 1
Error 2.0 +125 3
Factor
1.0

0.0
-40 -20 0 20 40 60 80 100 120 140
Temperature in C°

NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C.

Pressure Error Band

5.0
4.0
3.0
2.0
Pressure 1.0
Error 0 Pressure
(kPa) 0 25 50 75 100 125 150 175 200 225 250 (kPa)
-1.0
-2.0
-3.0
-4.0
Pressure Error (Max)
-5.0
20 to 250 kPa ±3.45 (kPa)

MPX4250A
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Freescale Semiconductor 5
 INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to design
design. The footprint for the surface mount packages must be boards with a solder mask layer to avoid bridging and
the correct size to ensure proper solder connection interface shorting between solder pads.
between the board and the package. With the correct
Footprint, the packages will self align when subjected to a

0.100 TYP 8X
0.660 2.54
16.76

0.060 TYP 8X
1.52 0.300
7.62

0.100 TYP 8X inch

2.54 mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

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 PACKAGE DIMENSIONS

-A-
D 8 PL
4 0.25 (0.010) M T B S A S
5 NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
G 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
8 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
1
INCHES MILLIMETERS
S DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
C 0.212 0.230 5.38 5.84
N D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
C H
K 0.061 0.071 1.55 1.80
J
-T- M 0˚ 7˚ 0˚ 7˚
N 0.405 0.415 10.29 10.54
PIN 1 IDENTIFIER SEATING S 0.709 0.725 18.01 18.41
PLANE
K M

CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE

-A- D 8 PL
4 0.25 (0.010) M T B S A S NOTES:
5 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
N -B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
8
1
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
S A 0.415 0.425 10.54 10.79
W B 0.415 0.425 10.54 10.79
C 0.500 0.520 12.70 13.21
D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
V J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
C M 0˚ 7˚ 0˚ 7˚
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
H V 0.245 0.255 6.22 6.48
J W 0.115 0.125 2.92 3.17
-T-
PIN 1 IDENTIFIER SEATING
M PLANE
K

CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE

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 PACKAGE DIMENSIONS

C
NOTES:
R 1. DIMENSIONING AND TOLERANCING PER
POSITIVE PRESSURE ANSI Y14.5M, 1982.
(P1) 2. CONTROLLING DIMENSION: INCH.
M 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
B 16.00 (0.630).
-A-
INCHES MILLIMETERS
N DIM MIN MAX MIN MAX
PIN 1
L A 0.595 0.630 15.11 16.00
1 2 3 4 5 6
SEATING B 0.514 0.534 13.06 13.56
PLANE -T- C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
J G G 0.100 BSC 2.54 BSC
S F J 0.014 0.016 0.36 0.40
D 6 PL L 0.695 0.725 17.65 18.42
0.136 (0.005) M T A M M 30˚ NOM 30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66
STYLE 1: STYLE 2: STYLE 3:
PIN 1. VOUT PIN 1. OPEN PIN 1. OPEN
2. GROUND 2. GROUND 2. GROUND
3. VCC 3. -VOUT 3. +VOUT
4. V1 4. VSUPPLY 4. +VSUPPLY
5. V2 5. +VOUT 5. -VOUT
6. VEX 6. OPEN 6. OPEN

CASE 867-08
ISSUE N
UNIBODY PACKAGE

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 PACKAGE DIMENSIONS

PAGE 1 OF 2

CASE 867B-04
ISSUE G
UNIBODY PACKAGE

MPX4250A
Sensors
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 PACKAGE DIMENSIONS

PAGE 2 OF 2

CASE 867B-04
ISSUE G
UNIBODY PACKAGE

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 NOTES

MPX4250A
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MPX4250A
Rev. 6
12/2006