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NDT Matrix

The document lists various non-destructive testing methods and the types of discontinuities, anomalies, and conditions they can detect. It includes surface and subsurface examination methods, volumetric methods, integrity examination, and condition monitoring techniques. A table provides an assessment of each method as being unsatisfactory, possible, or accepted for different detection capabilities.
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100% found this document useful (1 vote)
537 views

NDT Matrix

The document lists various non-destructive testing methods and the types of discontinuities, anomalies, and conditions they can detect. It includes surface and subsurface examination methods, volumetric methods, integrity examination, and condition monitoring techniques. A table provides an assessment of each method as being unsatisfactory, possible, or accepted for different detection capabilities.
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Surface an Near Surface Examination Method Magnetic Eddy Dye Particle Current penetrant DP MP EC Thermal Infrared

NDT methods Discontinuities surface anomalies surface connected anomalies Internal anomalies Structure molecular structure, crystalline structure and/or strain, lattice structure, strain, dislocation, vacancy, deformation grain structure, size, orientation and phase, sinter and porosity, impregnation, filler and/or reinforcement distribution, anisotropy, heterogeneity, segregation leaks (lack of seal or throughholes), poor fit, poor contact, loose parts, loose particles, foreign objects assembly errors, misalignment, poor spacing or ordering, deformation, malformation, missing parts

Visual

ACFM

Volumetric Examination Method / Subsurface Acoustic Phased Resonance Radiogr Ultrasoni Laser UT EMAT Arrays TOFD MFL aphy R cs UT LUT Technology UT PA ART

Integrity Examination Method Internal Rotary Acoustic Leak Test Inspection Emission LT System IRIS AE

Condition Monitoring Method Thermography Guided Vibration Infrared Waves Analysis VA Testing IR LRUT

pitting, inclusions, roughness, scratches, gouges P cracks, porosity, pinholes, laps, P seams, folds, inclusions cracks, separations, hot tears, cold shuts, shrinkage, voids, lack of fusion, pores, cavities, U delaminations, disbonds

P P

P A

P U

P P A A A

P A

Microstructure

Matrix Structure

Small structural anomalies

Gross structural anomalies Dimension & Metrology

Displacement position

linear measurement, separation, gap size, discontinuity size, depth, location and orientation unevenness, nonuniformity, eccentricity, shape and contour, size and mass variations

Dimensional Variations

P Thickness, Density Stress and Dynamic response heat-treatment, annealing and cold-work effects, residual stress and strain, fatigue damage and life (residual) film, coating, layer, plating, wall and sheet thickness, density or thickness variations

Stress, Strain, Fatigue

Mechanical damage Chemical damage, Corrosion

P wear, spalling, erosion, friction P effects corrosion, stress corrosion, phase P transformation

U U A P A A A A

Dynamic performance

crack initiation and propagation, plastic deformation, creep, excessive motion, vibration, damping, timing of events, any anomalous behavior potential, strength, field distribution and pattern isotherms, heat contours, temperatures, heat flow, temperature distribution, heat leaks, hot spots noise, vibration characteristics, frequency amplitude, harmonic spectrum and/or analysis, sonic and/or ultrasonic emissions distribution and diffusion of isotopes and tracers image enhancement and quantization, pattern recognition, densitometry, signal classification, separation and correlation, discontinuity identification, definition (size and shape) and distribution analysis, discontinuity mapping and display

Signature analysis Electromagnetic Field

Themral Field

Acoustic signature

Radioactive signature

Signal or Image analysis

U = UNSATISFACTORY METHOD P = POSSIBLE A = ACCEPTED

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