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70 2501 0003 Kester Solder

Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework, featuring a gel-like consistency that allows for precise application and excellent thermal stability. It is compatible with various no-clean chemistries and leaves a cosmetically appealing residue that does not require removal. The product meets RoHS compliance and has a shelf life of six months when stored properly.

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9 views2 pages

70 2501 0003 Kester Solder

Kester RF741 is a high-viscosity, no-clean flux designed for electronic component rework, featuring a gel-like consistency that allows for precise application and excellent thermal stability. It is compatible with various no-clean chemistries and leaves a cosmetically appealing residue that does not require removal. The product meets RoHS compliance and has a shelf life of six months when stored properly.

Uploaded by

dasrh 12
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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®

RF741
No-Clean Electronic-Grade Rework Flux

Product Description Physical Properties


Kester RF741 is a high-viscosity, no-clean flux Viscosity (typical): 180 poise
designed for electronic component rework and Malcom Viscometer @ 10rpm and 25°C
repair applications. Kester RF741 has a gel-like
consistency and is easily applied by syringe Acid Number: 75.0 mg KOH/g of flux
Tested to J-STD-004, IPC-TM-650, Method 2.3.13
dispensing. Kester RF741 can be precisely
dispensed onto a specific area that needs flux. Reliability Properties
After being dispensed, Kester RF741 stays in
place until soldering occurs. Traditional problems Copper Mirror Corrosion: Low
experienced with controlling the application of low Tested to J-STD-004, IPC-TM-650, Method 2.3.32
solids no-clean liquid fluxes are eliminated.
Kester RF741 has excellent performance in Corrosion Test: Low
applications requiring a flux having good thermal Tested to J-STD-004, IPC-TM-650, Method 2.6.15
stability such as surface mount component repair.
Kester RF741 is the ideal choice for QFP or BGA Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
semi-automated rework operations. In addition,
RF741 is well suited for use with through-hole Chloride and Bromides: None Detected
repair operations where solder fountain or Tested to J-STD-004, IPC-TM-650, Method 2.3.35
controlled solder reservoir is being used for
selective component removal and repair. Fluorides by Spot Test: Pass
Residues that remain on surfaces after soldering Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

are almost colorless, leaving a very cosmetically


SIR, IPC (typical): Pass
appealing repair. The residue has high electrical Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
resistance and can be left on the assembly after
soldering. Residues are compatible with all Blank RF741
no-clean fluxes in the Kester product line. Kester Day 1 2.5 ×10 Ω 10
4.0 × 108 Ω
RF741 can be used in combinations with Kester
Day 4 1.5 ×1010 Ω 1.6 × 109 Ω
no-clean cored wire solders and no-clean solder
pastes, as well as no-clean liquid fluxes without Day 7 1.4 ×1010 Ω 4.0 × 109 Ω
any compatibility risks.

Performance Characteristics: RoHS Compliance


• Compatible with most no-clean chemistries This product meets the requirements of the RoHS
• Leaves bright/shiny solder joints after reflow (Restriction of Hazardous Substances) Directive,
• Classified as ROL0 per J-STD-004 2002/95/EC Article 4 for the stated banned
• Compliant to Bellcore GR-78 substances.
RF741
Application Notes
Cleaning:
Kester RF741 is a no-clean chemistry. The residues do not need to be removed for typical applications. If
residue removal is required, call Kester Technical Support.

Storage, Handling, and Shelf Life:


RF741 should be kept at 15-32°C (60-90°F). Shelf life is 6 months from date of manufacture when handled
properly and held at 15-32°C (60-90°F).

Health & Safety:


This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.

World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143 USA
Phone: (+1) 847-297-1600 • Email: [email protected] • Website: www.kester.com
Asia Pacific Headquarters European Headquarters Japanese Headquarters
500 Chai Chee Lane Zum Plom 5 20-11 Yokokawa 2-Chome
Singapore 469024 08541 Neuensalz Sumida-Ku
(+65) 6449-1133 Germany Tokyo 130-0003 Japan
[email protected] (+49) 3741 4233-0 (+81) 3-3624-5351
[email protected] [email protected]

The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten-
tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
Rev: 14Jan07

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