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14-Cache Memories-05-Sep-2018 - Reference Material I - Types of Main Memories

RAM can be read and written to and is used for temporary storage. The two main types are DRAM and SRAM. DRAM stores data using capacitors that need refreshing, while SRAM uses transistors to store data without refreshing. ROM can only be read from and is non-volatile, storing data permanently. Different ROM types include PROM, EPROM, and EEPROM, which can be programmed once or erased and rewritten electrically.

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0% found this document useful (0 votes)
51 views18 pages

14-Cache Memories-05-Sep-2018 - Reference Material I - Types of Main Memories

RAM can be read and written to and is used for temporary storage. The two main types are DRAM and SRAM. DRAM stores data using capacitors that need refreshing, while SRAM uses transistors to store data without refreshing. ROM can only be read from and is non-volatile, storing data permanently. Different ROM types include PROM, EPROM, and EEPROM, which can be programmed once or erased and rewritten electrically.

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Types of Main Memories

Semiconductor Memories
• Random Access Memory (RAM)
• Read Only Memory (ROM)
RAM
• Reading and writing is possible
• Both are accomplished using electrical
signals.
• Volatile – so, used only as temporary
storage.
• Two technologies
– Dynamic RAM (DRAM)
– Static RAM (SRAM)
Dynamic RAM
• Stores data as charge on capacitors
• If capacitor is charged
– Data is 1
• Else
– Data is 0.
• Needs refreshing cycle as capacitors have a tendency of
discharging.
• The term dynamic refers to this tendency of the stored
charge to leak away, even with power continuously
applied.
• Volatile
• When read, data is lost. So, restoring need to be done.
Dynamic RAM
• DRAM cell
– Consists of a transistor
and a capacitor.
– Transistor acts a switch
• If transistor is closed
– Allows current to flow
• Else
– No current flows
Dynamic RAM
• Write
– Voltage signal is applied to the bit line.
• High voltage – 1
• Low voltage – 0
– Address line is activated allowing the charge to be transferred to
the capacitor
• Read
– Address line is activated
– Charge on capacitor is fed out onto a bit line and to a sense
amplifier.
– Sense amplifier compares with reference value and determines if
the cell contains 0 or 1.
– The value is restored
• Used for large memory requirements
Static RAM
• Holds the data as long as the power is supplied
• Read operation don’t destroy the original data.
• Expensive than DRAM but shorter cycle times.
• Used for faster small memories like cache
memory.
• Uses 4 – 6 transistors to store a single bit of
data
• Less power consumption than DRAM
• Complex construction
• Digital
– Use flip-flops
SRAM
• Transistor arrangement gives
stable logic state
• Logic State 1
– C1 high, C2 low
– T1 T4 off, T2 T3 on
• Logic State 0
– C2 high, C1 low
– T2 T3 off, T1 T4 on
• Address line controls two
transistors T5 T6.
• When signal is applied to address
line, T5 and T6 are on.
• Write – apply value to B &
complement to B
• Read – bit value is read from line
B
SRAM DRAM
- Volatile - volatile
- Faster - slower
- smaller memory units - larger memory units
- Complex construction - simpler to build
- Don’t require - require refresh
refreshing circuit
- Cache memory - Main memory
- Larger per bit - smaller per bit
- Digital - analog
ROM
• Can only be read
• Non-volatile
• Secured – virus do not infect the true ROM
• Applications
– Microprogramming
– Library subroutines
– System programs
– Function tables
ROM
• Constructed from
hard – wired logic
encoded in the
silicon it self
• If the diode is
connected, it binary
1 else 0.
Types of ROM
• Written during manufacture
– Very expensive for small runs
• Programmable (once)
– PROM
– Needs special equipment to program
• Read “mostly”
– Erasable Programmable (EPROM)
• Erased by UV
– Electrically Erasable (EEPROM)
• Takes much longer to write than read
– Flash memory
• Erase whole memory electrically
PROM
PROM
• Programmed using a special equipment
• Programming a PROM is also called as burning
• PROM chips have a grid of columns and rows just as ordinary
ROMs do.
• The difference is that every intersection of a column and row in a
PROM chip has a fuse connecting them.
• Since all the cells have a fuse, the initial state of a PROM chip is all
1s.
• To change the value of a cell to 0, you use a programmer to send a
specific amount of current to the cell.
• The higher voltage breaks the connection between the column and
row by burning out the fuse.
• This process is known as burning the PROM.
EPROM
•The first EPROM, an Intel 1702,
with the die and wire bonds clearly
visible through the erase window.

• Erasable programmable
• Erased using UV rays
• A little glass window is installed in the top of the ROM package,
through which you can actually see the chip that holds the memory.
• Ultraviolet light of a specific frequency can be shined through this
window for a specified period of time, which will erase the EPROM
and allow it to be reprogrammed again.
• Changes cannot be made incrementally; the complete chip must be
erased
• Fowler-Nordheim tunneling is used to change the value
EEPROM
• Electrically erasable programmable ROM
• Commonly used for BIOS programs.
• The chip does not have to removed to be rewritten.
• The entire chip does not have to be completely erased to change a
specific portion of it.
• Changing the contents does not require additional dedicated
equipment.
– Instead of using UV light, you can return the electrons in the cells of an
EEPROM to normal with the localized application of an electric field to
each cell.
– This erases the targeted cells of the EEPROM, which can then be
rewritten.
• Fowler-Nordheim tunneling is used to change the value
Comparison of different types of
main memories
References
• William Stallings “Computer Organization
and architecture” Prentice Hall, 7th edition,
2006

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