Your Technology Experts…2017

Your Full Service, Time Sensitive, Printed

Circuit Board Solution
Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB
manufacture of leading edge Technology and Innovation. We offer full service
solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick
Turn options along with Standard Production lead times. You will find that
Streamline holds the necessary certifications to insure the highest standards of
workmanship while supporting your companies specifications.

Mil / Aerospace DataCom TeleCom

Medical Industrial
2
 Streamline Circuit Corp’s Facility
• Manufacturing all levels of technology
– Time sensitive prototyping through production

• The facility was established in 1982

– New management team installed September 2003

• 70,000 sq. ft. PCB manufacturing facility

– Complete manufacturing process under one roof

• 1 mile from the San Jose Airport

– Delivery convenience for out of state customers

• Located in Silicon Valley

– Short car ride away for pick up & deliveries
Located in Silicon Valley
• Financially secure in current market
conditions
– Low cost infrastructure
3
 The Team & Their Experience
• Chuck Dimick- CEO | Founder
– Over 35 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder
of the company's predecessor, Dynamic Circuits Inc. (1991)

• Greg Halvorson- President | Founder

– Over 33 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc.
and Dynamic Circuits Inc.

• Tom Doslak-Vice President of Sales & Marketing | Founder

– Over 25 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional
Sales Manager for Dynamic Details Inc.

• Ed Pitney- Operations Manager

– Over with 34 years of PCB manufacturing experience. Ed spent his early career with NTI Inc. as a
Director of Manufacturing Operations later purchased by DDI Global Inc.

• Steve Morris – Director of Engineering

– Over 30 years of PWB Design & Engineering experiencing. Former VP of Advanced Technology for
Multek (a division of Flextronics) and a key member of the HP PWB Corporate commodity team.

• JR Ramirez- Production Manager | Founder

– Over 35 years of experience in the industry. Former Production Manager for both Dynamic Details Inc.
and Dynamic Circuits Inc.

• Lorraine Hook - Director of Quality

– Over 44 years of industry experience. Former Director of Quality for many successful companies
including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager.
4
 Customer Service Support
• Customer Service (24 hours - 7 days a week)
– Sales, Engineering, Manufacturing and Quality

• Dedicated customer service readily available-our

support group’s located onsite in the facility

• Quick response to all requests such as:

– Job status
– Delivery pull-in
– Quantity Increases
Inside Sales Customer – Engineering design modification
Support

5
 Proactive Engineering Services

• Manufacturing Capabilities
– Prototype though volume
– All time sensitive builds

• DFM (Design for Manufacturability)

– DFM Software (reviews in 10 minutes)
– Net list compare to customer data
Cam Valor Stations
– Custom Verification programs
– Looking for customer design error
– In plan Smart data Collection System

• Controlled Impedance Verification

– Stack up assistance
– Copper distribution
– Material verification
4 Laser Direct Imaging units

6
 Pre-Production Engineering
Services
• “In Plan” planning software
• Customer Specific Rules Based Automation

• Valor front end CAM (Unlimited Seats)

• Industry Standard for front end engineering

• Stack up consultations, Service Offered No Charge $

• Insight Frontline DFM’s, Service Offered No Charge $

• Tech Seminars /Webinars

• Material Science, Latest in Laminates and Pre Preg’s

• R&D, Building the Toughest to Gain the Knowledge

When you need it, we will be ready!
7
 Quality Reassurance
• Net list compare prior to MFG
– Matching Net list to Gerber data
• Front End DRC (design rule check)
– Searching for customer design mistakes
• AOI Automated Optical Inspection
– Verifying inner & outer layers
• X-Ray Verification
– After Lam (Inspecta), After Drilling
Automated Optical Inspection • Cross Section Verification
– Hole Integrity True-Chem Software
• Controlled Impedance Testing
– TDR test of panel coupons
• 100% Net List Test On All Product
– Eliminator Tester & flying probe
• Coordinate Measurement Machine
– First articles, 100% measurement verification
In house Mil & deliverable Lab

8
 On Time Delivery Reassurance

• 100% In-house manufacturing from start to

finish
– Control delivery & customer flexibility
– In-process quality verification system
– No out sourcing delivery delays

• Employee Training program

8 flying Probe Testers
– Performance evaluation every 6 months

• In-house Chemical Laboratory

– Cross Sections
– Chemical analysis
– Mil spec verification
Vacuum Lamination press

9
 Continuous Improvement Programs

• Working daily on:

– Research and Development
– Pre-Engineering Programs
– Improvement Process Program
Management meetings – Department Performance Reviews
– Preventative maintenance program
– Employee Training Program
– Planned Capital expense program

7 Laser drills

10
 A Full PCB Solution

• Multilayer Rigid / Rigid- Flex / Flex • AS9100 Rev. C / ISO 9001 / ISO 13485
• 1 to 70 Layers Plus • Mil-Spec 55110 / ITAR
• 28:1 High Aspect Ratio • RoHS & Halogen Free Materials
• 3.23 Mils Hole to Copper • IPC 6012 Rigid / 6013 Flex / 6015 MCM
• Buried / Blind Vias / 6016 HDI / 6018 High Frequency
• 9 Sequential Laminations • 3 Mil Mechanical Drills
• 13+ Stacked Vias • 24” x 30” Oversize Panel
• 1 Mil Trace & Space • 2 Mil Laser Drill Vias
• Cavity Constructions • Up to 345 Mils Board Thickness
• 6 oz. + Copper Thickness • Via Under Pad (Conductive & Non-
• Copper Filled Micro Vias Conductive Filled)
• +/- 5% Controlled Impedance Tol. • 65+ Materials (Hybrid Constructions)

11
 PCB TECHNOLOGY ROADMAP
Standard Advanced Emerging Engineering
Manufacturing Manufacturing Technology walk through

1. Line and Space Line Width .003”

.0038” .002” .001” .0005”
Line Space .003”
.0038” .002” .001” .0005”
+/-.001””
+/-.001 +/-.00075” +/-.0005” +/-.00025”
Tolerance
Drill Size
2. Drilled Via Size .008” .004” .003” .003”
Pad Diam +.010” +.008” +.006” +.002”
Aspect Ratio 28:1 20:1 20:1 28:1

3. Misc. Attributes Layer Count Up to 36 36 to 48 48 to 60

Thickness Up to .187” Up to .300” Up to .350” >.350
Board Size <16”X22” <19”X22” <22X28

Next
FR4
Interposer Generation Nano Foils
Polyimide
4. Laminate Materials Rigid PTFE Substates HSD Alternative
UTR’s Advanced Resin Systems
HC (Rogers)
Interposers
Flex EMI Shield High Speed
Rigid Flex Conductive Flex High
Flex UL
FR4 Bond Ply Reliability
*UTR = Ultra Thin Rigid Thin Flex Flex
Multilayers
Stiffeners
UL Approved Data Security

12
http://streamlinecircuits.com/high-speed-materials/
 TECHNOLOGY ROAD MAP CONTINUED
Standard Advanced Emerging Engineering
Manufacturing Manufacturing Technology Walk through

5. Micro Via Size Via Size .004” .003” .002” .001”

Pad Dam +.005” +.004” +.004” +.003”
.6:1 1:1 2:1 3:1
Aspect Ratio

HASL
6. Surface Finishes Entek
LF HASL
Eless Au
Imm Silver Solder TBD
Sel Solder
ENIG Bump
Imm tin
ENEPIG

+/-.003” +/-.002” +/-.001”

7. LDI Soldermask Registration
.006” .003” .002”
Tangency
Min opening

8. Conductive and Min hole

.012” .010” .008” <.008
Non-Conductive Via Fill Aspect Ratio 8:1 12:1 18:1 20:1

13
Nadcap

ISO 9001:2000

IPC 6012,13,15,16,18
Class 3

ITAR

AS9100 Rev C

Mil-Spec 55110

Mil-Spec 31032 in process

 Q-Pulse
Total Quality Management

• Quality Assurance Systems

– Q-Pulse Quality System
• NCMR’s and Corrective Actions
• Audits
• Training
• Equipment Calibrations

15
 Streamline’s Capital Expenditures

• Use advanced equipment technologies to

manufacture today's printed circuit board
Laser Direct Imaging requirements

• The future in PCB manufacturing is about

technology and automation
Cuposit & Electroless Line

• Hire and Train equipment operators

• High percentage engineering personnel and

staff
DES Inner Layer Stripline
16
 V-Stacks: Patented MicroVia technology that will change everything

A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing

process that will change everything we know about Via Stacking. This technology allows a
manufacturer to create MicroVia structures greater than 4 layers deep with only 1 lamination
cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the
30% - 60% reduction in processing, this MicroVia technology is a cost effective route for
advanced technology.

17
 Rigid-Flex Examples

6 Layer 10 Layer
8 Layer Rigid
Rigid Flex Micro via
Flex Micro via
BGA

6 Layer Rigid
Flex with
Cavity
IPC Manufacturing Class & Industries

4%

33%
Class 3
Class 2
Other
63%

15%
28% Military
17% Aerospace
Medical
Communication
15% 25% Industrial

19
 Streamline Circuits Corp.
1401 Martin Ave, Santa Clara, CA 95050 USA
(877) 264-0343
[email protected]