PSM TEMPLATE

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV. 23, 2004
STATION : MOLD /DTFS OWNER : NONIE NANEZ

Step 1. Problem Definition/Objective :

Eliminate package chip-out / crack Customer complain

for P1-2.

Package chip-out / crack Photo

Microcrack/microgap/hairline crack on
Chip / crack on bottom Chip / crack on top package Chip / crack on center of package package corner parting line of top and
corner package edge (SOIC 8 ) (SOIC 14 ) bottom package
(SOIC 8 ) (SOIC 8)
% Contribution
20 % 20 % 40 %
20 %
TPM FI structure rev.0: 1/9/02
PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD /DTFS OWNER : NONIE NANEZ

Step 2. Trend Chart / Goal

P VOC trend chart

5
P
4
M Chip'crack occ
3
2 Goal
1
0
2002 2003 Q1 '04 Q2 '04 Q3 '04 OCT'04 WW44 WW45 WW46

2002 2003 Q1 '04 Q2 '04 Q3 '04 OCT'04 WW44 WW45 WW46

Chip'crack occ 3 0 0 0 2 0 0 0 0
Goal 0 0 0 0 0 0 0 0 0 0 0

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD /DTFS OWNER : NONIE NANEZ

Step 3/4. Pareto Analysis

Per Package Per lead count
OCC OCC
5 5

4 4

3 3

2 2

1 1

0 0

SOIC1 SOIC2 PDIP 8 14 16

OCC 5 0 0 OCC 4 1 0

Per Station: Per Rootcuase:

OCC
OCC 2

5 1.5

4 1

0.5
3
0
2
M A TERIA L
STUCK M OLD JA M M ED UNIT
DEB RIS ON COM POSITION
CLEA NER ON ON V / M
DECULLER DIE / M OLD
1 CA V ITY SEESA W
EJECTION
OCC 1 1 1 2
0

MOLD MARK DTFS/FVI

OCC 4 0 1

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD /DTFS OWNER : NONIE NANEZ

Step 5. Data Gathering Evaluations

5.1 Defect Mapping

Defect Categorization Description How Many?
( illustration or drawing of defect ) ( # of occurence )
( thru data logsheet or actual units )

*CHIP/ CRACK LOCATED ON BOTTOM CORNER EDGE 1 Occurrence

A PACKAGE (PIN#4) INDUCED DURING MOLD DECULLING
PROCESS.

*CHIP/ CRACK LOCATED ON TOP (IN-BETWEEN PIN 5 & 6). 1 Occurrence

B INDUCED DUE STUCKED EMC ON CAVITY BAR..

*CHIP/ CRACK LOCATED ON CENTER OF THE PACKAGE. 1 Occurrence

INDUCED DURING JAMMING AT V/M SEESAW
C

*MICROCRACK LOCATED ON CORNER OF THE PACKAGE. 2 Occurrences

D INDUCED DUE TO CHANGES IN EMC COMPOSITION AND
MOLD EJECTION SYSTEM DESIGN

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD / DTFS OWNER : NONIE NANEZ

Step 5 : Data Gathering evaluation

• Conduct cause & effect analysis based on categories as chip / crack.

Note: Station focus was on Mold as high number of defect.
MOLD

Runner remains / stucked

on deculler die Strip misalignment
MATERIAL
during deculling process
Excessive force apply
during mold tool opening Mold Ejection System
EMC changes (kneading
temp and resin viscosity) not robust design
Chip/crack
Insufficient magnification
use during inspection
Broken singulation parts
Insufficient mold tool Mold debris stucked on
cleaning and conditioning FORM / SINGULATE tool die

Too fast stroke count

METHOD
DB/DJ

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD / DTFS OWNER : NONIE NANEZ

Step 5 : Data Gathering evaluation

• Conduct defect mapping & process simulation on Category D of the affected units as chip/crack.
STATION CONTACT MECHANISM TO PACKAGE DEFECT SIGNATURE REMARKS
1.0 UPPER AND LOWER MOLD CHASE The mechanical contact to package
CAVITY body happens in Mold Tool Chase,
when each cavity (of top & bottom)
enclosed to form the package on its
designed shape. When the clamp
opens, some units may sticked on
the chase due to emc releasability
factor or planarity of strip ejection.

1.0 Hairline fissure along the parting line of

top and bottom surface
A. Mold filling stage (Clamp-Close) T op cavity ejector
T op cavity

Bottom cavity

MOLD
Potential effect

2.0 Crack propagated from top downward

to bottom package

B. Clamp-Open

Runner remains on deculler plate

2.0 @ DEGATOR/DECULLER
induces crack/chipout on bottom
package
--> intentionally put
runner remains on
degate plate

- Crack/chipout on bottom package at

severe condition

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD / DTFS OWNER : NONIE NANEZ

Step 5 : Data Gathering evaluation

STATION CONTACT MECHANISM TO PACKAGE DEFECT SIGNATURE REMARKS
1.0 TOOL DIE N/A Based from the simulation,
there will be no debris that will
remain/stucked on the degate and
dambar die because these are nest
free design (open through)
No contact mechanism on package
DB/DJ

- Intentionally put runner/debris on tool die Fig.1 : Nest free design

1.0 At Trim/Forming stage No contact mechanism on package

N/A due to Nest Free design of toolings
(open through)

2.0 At Singulation stage

N/A

TFS

3.0 At Package Pusher assembly Package Crack/chipout at severe condition Clogging of units at cover pusher
(pushing the singulated units to output tray) assembly while ongoing tfs process
induces package/leads damage in
severe condition

--> Intentionally obstruct the pathway of units

going to output tray

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD / DTFS OWNER : NONIE NANEZ

Step 5 : Data Gathering evaluation

Possible Causes:
Process Possible Causes Probability
Drift of EMC material;
-- Kneading Temperature change
Material High
-- Resin Viscosity change.

Unbalance ejection system. High

Insufficient conditioning of new High

Mold mold tool.

Single step during tool opening. High

Fast speed to db/dj machine.

DB/DJ low

TFS machine problem.

TFS low

Escape point:
Process Escape point Probability
Only 30x mag is being used
during package inspection.
DB/DJ High

Only 30x mag is being used High

during package inspection.
TFS
Only 2 sides are being inspected High

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD / DTFS OWNER : NONIE NANEZ

Step 5 : Data Gathering evaluation

Based from the process mapping and simulation conducted, below are the possible causes of
package crack.
5.1 drift of EMC material
-- Kneading Temperature change
-- Resin viscosity change

5.2 Unbalance ejection system of mold tool.

5.3 Insufficient mold tool conditioning

Step 6 : Observation/Data Summary/ Facts Sheet

Pkg crack

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD / DTFS OWNER : NONIE NANEZ

As shown on illustration, package crack can happen in case force(1) is bigger than force(3).
Package cracks, if force(1) > force(3)
Therefore, increase of force(1) or decrease of force(3) will be major contributor of pkg crack.

In case of decrease of force(3) => package strength

Force(3) is package strength after curing and it is related to degree of cross linking of the resin and hardener.
This package strength is determined by curing property.

Step 7. Root Cause Analysis

-. As a package crack failure mechanism, in case releasing force between mold cavity and molding compound is
bigger than package strength of molding compound, package crack can happen.
-. There was drift in molding compound manufacturing process( variation of kneading temp, lower resin viscosity)
and this drift affected curing property and eventually weakened the package strength which is prone to package
crack.
-. In ass’y process, we decreased mold cure time to 60sec. 60sec mold cure time also can be an contribution
factor on pkg crack since the curing property of drifted 6600CS shows very low curing torque at 60 sec cure time

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD / DTFS OWNER : NONIE NANEZ

Step 8 : Rootcause Verification / Turn-on/off

• Conduct on/ off validation based on the defect signature as per Category D.

PACKAGE CRACK INSPECTION RESULTS FOR ALL AUTOMOLD MACHINE REGARDLESS OF EMC AND PAD SIZE
Automold machine Customer # Lots inspected @ 50x mag Sample size Frequency Results
Intersil 22 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 7 lots 22 units/ monitor 2x/mach /shift No package crack
Cypress 55 lots 22 units/ monitor 2x/mach /shift No package crack
SOFA001 Melexis 2 lots 22 units/ monitor 2x/mach /shift No package crack
FSC 6 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 27 lots 44 units/ monitor Per lot No package crack
Analog 226 lots 22 units/ monitor 2x/mach /shift No package crack
SOFA002 FSC 44 lots 22 units/ monitor 2x/mach /shift No package crack
Intersil 74 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 16 lots 22 units/ monitor 2x/mach /shift No package crack
SOAA003 FSC 6 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 16 lots 44 units/ monitor Per lot No package crack
Analog 261 lots 22 units/ monitor 2x/mach /shift No package crack
Intersil 17 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 8 lots 22 units/ monitor 2x/mach /shift No package crack
Cypress 35 lots 22 units/ monitor 2x/mach /shift No package crack
APM003
FSC 9 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 19 lots 44 units/ monitor Per lot No package crack
Analog 125 lots 22 units/ monitor 2x/mach /shift No package crack
Intersil 7 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 6 lots 22 units/ monitor 2x/mach /shift No package crack
APM003 FSC 7 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 17 lots 44 units/ monitor Per lot No package crack
Analog 205 lots 22 units/ monitor 2x/mach /shift No package crack

TOTAL 1217 LOTS

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23’04
STATION : MOLD /DTFS OWNER : NONIE NANEZ

Step 9 : Define the Root Cause

Drift in molding compound manufacturing process( variation of kneading temp, lower resin viscosity)
and this drift affected curing property and eventually weakened the package strength which is prone to
package crack.
Step 10 : Solution Identification
Improvement Actions done for Package crack
Status
Pkg /Leads Station Actions impelemented Resp When
Installed additional e-pin on 8L auto RKALA ww26 done
mold tool

Ehanced mold tool conditioning. ALESC/ WW22 sustain

- Cleaning every 400 shots JOCAR
Mold
- Conditioning every EMCchange
Start of shift / every tool cleaning.

Implemented 2-steps clamp open. RKALA WW24 done

Stabilized EMC kneading temperature SUMITOMO JUNE'2004

Materials and resin viscosity. sustain
soic008
Implemented 50x magnification for NNANE WW28 sustain
package crack inspection.

Enhanced procedures for package crack NNANE WW28 sustain

inspection methodology. (all side must
Method be inspected).

Enhanced buy-off procedures of equipement ALESC WW42 done

- new machine / tool
- newly refurb
- newly modified

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23, ‘04
STATION : MOLD /DTFS OWNER : NONIE NANEZ

Step 11 : Solution Evaluation

Monitor consecutive lots processed on all automold machines after implementation of corrective action.
Result: see below data.

PACKAGE CRACK INSPECTION RESULTS FOR ALL AUTOMOLD MACHINE REGARDLESS OF EMC AND PAD SIZE
Automold machine Customer # Lots inspected @ 50x mag Sample size Frequency Results
Intersil 22 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 7 lots 22 units/ monitor 2x/mach /shift No package crack
Cypress 55 lots 22 units/ monitor 2x/mach /shift No package crack
SOFA001 Melexis 2 lots 22 units/ monitor 2x/mach /shift No package crack
FSC 6 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 27 lots 44 units/ monitor Per lot No package crack
Analog 226 lots 22 units/ monitor 2x/mach /shift No package crack
SOFA002 FSC 44 lots 22 units/ monitor 2x/mach /shift No package crack
Intersil 74 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 16 lots 22 units/ monitor 2x/mach /shift No package crack
SOAA003 FSC 6 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 16 lots 44 units/ monitor Per lot No package crack
Analog 261 lots 22 units/ monitor 2x/mach /shift No package crack
Intersil 17 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 8 lots 22 units/ monitor 2x/mach /shift No package crack
Cypress 35 lots 22 units/ monitor 2x/mach /shift No package crack
APM003
FSC 9 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 19 lots 44 units/ monitor Per lot No package crack
Analog 125 lots 22 units/ monitor 2x/mach /shift No package crack
Intersil 7 lots 22 units/ monitor 2x/mach /shift No package crack
IDT 6 lots 22 units/ monitor 2x/mach /shift No package crack
APM003 FSC 7 lots 22 units/ monitor 2x/mach /shift No package crack
Maxim 17 lots 44 units/ monitor Per lot No package crack
Analog 205 lots 22 units/ monitor 2x/mach /shift No package crack

TOTAL 1217 LOTS

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL -PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23, ‘04
STATION : EOL OWNER : NONIE NANEZ

Step 11 : Solution Evaluation: Impact Assessment

Action Plan

Manufacturability X None required

Reliability / Required
Productivity X None required
Cycle Time X None required
X None required

Step 11 : Solution Evaluation: Final recommendation

Human QUADRANT QUADRANT

Dependent I II

Is it Poka yoke or
Human Dependent ?
Poka-yoke QUADRANT
III QUADRANT IV

Reactive Pro-active

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL -PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23, ‘04
STATION : EOL OWNER : NONIE NANEZ

Step 11 : Solution Evaluation: Result after implementation

P VOC trend chart

5
P
4
M
3 Chip'crack occ
2 Goal
1
0
2002 2003 Q1'04 Q2'04 Q3'03 OCT NOVTD

2002 2003 Q1'04 Q2'04 Q3'03 OCT NOVTD

Chip'crack occ 3 0 0 0 2 0 0
Goal 0 0 0 0 0 0 0 0 0 0 0

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL -PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23, ‘04
STATION : EOL OWNER : NONIE NANEZ

Step 12 : Solution Fan-out

Package crack / chip-out repeats (CCAR BKM ACTIONS) P1-2 BKM
DOCUMENTATION
Pkg /Leads Station Actions impelemented SOIC1 SOIC2 RBOSCH PDIP
Installed additional e-pin on 8L auto / x x x Mold tool PO specs
mold tool

Ehanced mold tool conditioning. / / / / SOIC CONTROL PLAN

- Cleaning every 400 shots
- Conditioning every EMCchange
Mold Start of shift / every tool cleaning.

Increased mold cure time to 90 sec . / / / / SOIC CONTROL PLAN

Implemented 2-steps clamp open. / x x x SOIC FMEA

soic008 Stabilized EMC kneading temperature / / / /

Materials and resin viscosity.

Implemented 50x magnification for / / / / SOIC CONTROL PLAN

package crack inspection.

Enhanced procedures for package crack / / / / SOIC CONTROL PLAN

inspection methodology. (all side must
Method be inspected).

Enhanced buy-off procedures of equipement / / / / EQUIPMENT BUY-OFF SPECS

- new machine / tool
- newly refurb
- newly modified

LEGEND: / -- APPLICABLE
X -- NOT APPLICABLE

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL -PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23, ‘04
STATION : EOL OWNER : NONIE NANEZ

Step 13 : Solution Documentation

• Update Existing FMEA for chip/crack.

Fmea #: SO-TF

• Updated SOIC control plan

Specs #: 02-0000-5217

• Updated Equipment qualification buy-off

Specs #; 02-0634-1204

Step 14 : Training / Personnel Requiring Information

• Checklist for personnel requiring Information / Training.

WHEN RESP Status

MEE/ PM YES oct'04 rkala / edwia done
Process Engrs YES oct'04 nnane/alesc done
Operators/ Mfg YES oct'04 bjard/ dsill done
QC/ QA YES oct'04 rvela done
IE/ PC no NA NA NA

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23 , ‘04
STATION : EOL OWNER : NNANE

Step 15. Improved Solution Implementation Plan

Option to improve solution.

All actions are fixed and properly documented.

TPM FI structure rev.0: 1/9/02

PACKAGE : SOIC PSM NO. : EOL-PCO-001
DEP’T : PROCESS ENGG PROBLEM-SOLVING METHODOLOGY DATE REV. : NOV 23, ‘04
STATION : EOL OWNER : NNANE

Step 16. Congratulations

CONGRATULATIONS TO THE TEAM MEMBERS!!!

NONIE NANEZ PSM CHAMPION EOL PE

ARNOLD LESCANO MOLD EOL SR ENGR.
ROEL KALAW MOLD M.E SEC. MANAGER
TED TANCHUAN DTFS M.E. SR. ENGR
DING SILLA DTFS / FVI PROD’N FOREMAN
BUBOY JARDIN EOL PROD’N MANAGER
JONATHAN CARDONA MOLD EOL PE
GERRY CASTRO DTFS EOL PE
KELVIN DE JESUS EOL PE
JONATHAN ROGUEL EOL PE
ARABELLE BUSUEGO EOL PE

TPM FI structure rev.0: 1/9/02