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Ferroelectric Ceramics: Properties, Applications and Processing of Barium Titanate (Batio)

Ferroelectric ceramics like barium titanate (BaTiO3) have several useful properties including high dielectric constants, low dielectric loss, and nonlinear electrical behavior. They exhibit hysteresis loops when polarized by an electric field which can indicate properties like memory and switching behavior. Common processing methods include mixed oxide and sol-gel synthesis along with sintering. Applications include capacitors, sensors, and thin film optical waveguides due to their piezoelectric and pyroelectric properties.

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Murtaza Sieam
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0% found this document useful (0 votes)
232 views

Ferroelectric Ceramics: Properties, Applications and Processing of Barium Titanate (Batio)

Ferroelectric ceramics like barium titanate (BaTiO3) have several useful properties including high dielectric constants, low dielectric loss, and nonlinear electrical behavior. They exhibit hysteresis loops when polarized by an electric field which can indicate properties like memory and switching behavior. Common processing methods include mixed oxide and sol-gel synthesis along with sintering. Applications include capacitors, sensors, and thin film optical waveguides due to their piezoelectric and pyroelectric properties.

Uploaded by

Murtaza Sieam
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPTX, PDF, TXT or read online on Scribd
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FERROELECTRIC CERAMICS: PROPERTIES, APPLICATIONS

AND PROCESSING OF BARIUM TITANATE (BATIO3)


GOLAM MURTAZA MIRZA (1613013)
ALISAN IMAM PAVEL (1613014)
Advanced Ceramics:
Advanced ceramics, also known as technical
ceramics. Hardly any raw materials from
nature are used here; instead, pure and high
quality powders form the basis.

• Hardness
• Exceptional wear resistance
• Resistance to aggressive chemicals and
• High temperatures

Fig. 1: Advanced Ceramics


Ferroelectric materials:
HHHBJYHB

A group of crystalline dielectrics having


in a certain temperature range
spontaneous polarization, the
orientation of which can be reversed by
an electric field, which varies
significantly under the influence of
external factors.
Fig. 2: Domain structure in Ferroelectric ceramics
Properties:

• Dielectric Properties : Ferroelectrics are, in general, characterized by

(1) higher dielectric constants (200–10000) than ordinary insulating substances (5–
100), making them useful as capacitor and energy-storage materials,
(2) relatively low dielectric loss (0.1%–7%),
(3) high specific electrical resistivity (>1013 Vz cm),
(4) moderate dielectric breakdown (100–120 kV/cm for bulk and 500–800 kV/cm for
thin films), and
(5) nonlinear electrical, electromechanical, and electrooptic behavior.
• Hysteresis Loops : The hysteresis loop (polarization versus electric field) is the single
most important measurement that can be made on a ferroelectric ceramic when
characterize.

This loop is very similar to the magnetic loop (magnetization versus magnetic field)
one obtains from a ferromagnetic material. The very name “ferroelectric” has been
appropriated from this similarity, even though there is no ferro, i.e., iron constituent, in
ferroelectrics as a major component.

Hysteresis loops come in all sizes and shapes, and, similar to a fingerprint, identify
the material in a very special way.
in Fig. 3
(A) a linear tracing from a BaTiO3
capacitor,
(B) a highly nonlinear loop from a
low-coercive-field (soft) memory
ferroelectric
(C) a narrow, nonlinear loop obtained
from a slim-loop ferroelectric (SFE)
quadratic relaxor, and
(D) a double loop that typically is
obtained from a nonmemory
Fig. 3: Typical hysteresis loops from various ferroelectric ceramics:
antiferroelectric material in the PSZT (A) BaTiO3 capacitor, (B) soft (easily switchable) PZT, (C) PLZT
system. 8.6/65/35 relaxor, and (D) PSZT antiferroelectric material.
From Fig. 3
(1) the loop in (B) reveals that the material
has memory, whereas the loop in (C) indicates
no memory,
(2) high remanent polarization (PR) relates
to high internal polarizability, strain,
electromechanical coupling, and electrooptic
activity,
(3) for a given material, the switching field
(Ec) is an indication of the grain size for a
given material Fig. 3: Typical hysteresis loops from various ferroelectric ceramics:
(A) BaTiO3 capacitor, (B) soft (easily switchable) PZT, (C) PLZT
(4) a high degree of loop squareness 8.6/65/35 relaxor, and (D) PSZT antiferroelectric material.
usually indicates better homogeneity and
uniformity of grain size.
• Pyroelectric Properties: This effect occurs in polar materials and is manifested in a
change in polarization as a function of temperature. This results in a reduction of
the bound charge required for compensation of the reduced dipole moment on
increasing temperature and vice versa on decreasing temperature; thus, the change
in voltage on the material’s electrodes is a measure of the change in the material’s
polarization due to absorbed thermal energy.

• Optical and Electrooptic Properties: Unlike the PZT ceramics and other
ferroelectric materials that are opaque, the most outstanding feature of the PLZT
materials is their high optical translucency and transparency.
Processing methods of
ferroelectric materials:

• Mixed oxide methods of perovskite materials:

The process of comminution involves operations


such as crushing, grinding and milling.

The major problem in the material sintering is the


PbO volatility at about 800 degree c.

To minimize this problem, the pzt samples are


sintered in the presence of a lead source, such as Fig. 4: Flowchart for the mixed oxide processing
PbZrO3 and placed in closed crucibles. of piezoelectric ceramics
• Chemical processing methods :

A chemical vapor deposition process

Involves chemical reaction between volatile metal organic compounds of various


elements comprising the layered structure material to be deposited, with other gases in
a reactor, to produce a nonvolatile solid .

The solid deposits on a suitably placed substrate such as a conducting, semiconducting,


insulating, or complex integrated circuit substrate .

Initial interest in the chemical methods came due to the need to reduce the number of
optical defects in electrooptics PLZT ceramics prepared by conventional processing
routes .

Also been used in the production of ceramics other than transparent electrooptic
devices, e.g. high quality piezoelectric ceramics.
• Sol–gel technology : The sol–gel method is
known to produce materials from solutions
either in bulk, coating films, fibers or powders.

A very successful and efficient route for


obtaining high quality ferroelectric/piezoelectric
materials.

Significance of Sol –gel method -


(a) improvement of processing and properties of
conventional and
(b) creation of novel valuable materials.
Fig. 5: Products in different stages of sol–gel process
EXPERIMENTAL METHODOLOGY:

Solid state sintering : Advanced ceramics


are densified from powders by applying
heat—a process known as sintering

Fig. 6: Step by step sintering process


GENERALIZED HEATING SCHEDULE:
• Stage 1: . Removal of volatiles such as water.
• Stage 2: To promote chemical reaction of
powder components.
• Stage 3: It represents the heat-up to the
isothermal sintering .
• Stage 4: The majority of the densification and
microstructure development takes place,
which is then followed by a cool-down.
• Stage 5: An additional hold in this stage, prior
to the final cool-down of stage 6
Fig. 7: Heating cycle
• Stage 6: To relieve internal stresses or allow
for precipitation or other reactions.
EXPERIMENTAL PROCEDURE:

Powder

Final
Ball
Tablet
milling

Grinding
Pressing
Powder
Machine

Sinterin
g
STEP-1 : An equimolar mixture of BaCO3 STEP-2 : Slurry of BaCO3-TiO2
powder and a very fine titanium dioxide powder mixture in alcohol was
(TiO2) were used as the starting milled in the planetary mill for 10h.
The milling speed was set at 200
materials. The fine TiO2 powder was rpm. The milling was stopped for 5
prepared from TiCl4 by oxidation and min every 30 min of milling to cool
hydrolysis. at 612, 729, and 915°C.
The third
The first The second temperature
temperature temperature
STEP-3: Grinding is used to finish range is
range is
range is 670- about 820-
workpieces that must show high about 550- 820°C 950°C,
surface and high accuracy of shape 670°C BaTiO3+
and dimension. Ba2TiO4
BaCO3 + TiO2 BaCO3 →
+TiO2 →
→ BaTiO3 + Ba2TiO4 +
2BaTiO3
CO2 CO2
STEP-5: And Finally the powder
is pressed into a disc shaped
pallets. Presses deliver energy STEP-6: Final Product
through a force that acts over a
distance
Application:
Heat resistance and other desirable properties have lead to the development of
methods to toughen the material by reinforcement with fibers and opening up
with more applications for ceramics.
 Structural: Applied as thermal barrier coatings to protect metal structures
wearing surfaces, wear parts or as integral components by themselves.
 Electricals: Capacitors , insulators, IC packages , piezo-electrics, magnet and
superconductors.
 Chemical and Environmental: Filters, membranes, thin films etc.
PYROELECTRIC DETECTORS:

Pyroelectricity is the polarization


produced due to small change in
temperature.
 Motion Sensors:
 Door safety sensor.
 Gas Sensors:
 Detect and monitor gasses.
 Food Sensors:
 To detect food-related substances
such as fat, lactose, or sugar Fig. 8: Different types of sensors
FERROELECTRIC THIN FILM WAVEGUIDES :
 Controls the propagation of light in a
transparent material.
 Its refractive index should be higher than
that of the substrate.
 A great deal of work has been done on
making ferroelectric thin film waveguides
from PZT and PLZT.
 PLZT thin films are even better candidates
for optical waveguide applications because
of their large electro-optic coefficients.
CAPACITORS :

 A capacitor consists of a dielectric material sandwiched


between two electrodes.
 Large dielectric constant.
 Perovskite type structure.
 Simple to make.
 Allows large capacitance values.

Fig. 9: Different types of capacitors


FERROELECTRIC MEMORIES :

• Supply non volatile memories


(FRAM’s) at cheaper rate.
• High speed (30 ns cycle time for
read/erase/rewrite)
• high density (4(μm)2 cell size)
• FRAM’s allow for the use of device
which contains memories in harsh
Fig. 10. Microchip
environments such an outer space.
ELECTRONIC PACKAGING:

 Chosen to securely hold microelectronics &


provide heat transfer.
 Must match the thermal expansion coefficient of
the microelectronic chip & the electronic
packaging material.
 Additional requirements include:
 Good heat transfer coefficient.
 Poor electrical conductivity.
Conclusion:

In today's world, the interest for the ferroelectric ceramics is illustrated in various
applications. The manufacture improvement of these ceramics by various method is
revealed by their great potential applications in integrated electronics as passive
components and as nonvolatile ferroelectric memories, suitable in electronic
components.

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