8D Corrective Action Report

Defect Type/ Name: Bump , Poor surface , Surface white marks

Customer Part Name / Model Name : HCS Base Seat /PR000077
Name of the Company: KOSTECSYS CO.,LTD
Report prepared by: jm. Jeong
D1 Team Approach

Name Position
Team Leader JM. Jeong QA Group , Manager

Team Members SY. Kim QA group, Assistant

MI. Heo R&D Director
GH. Lee Production Engineering group, Manager
MJ. Jang Production Engineering group, Assistant
Paul Park Sales Director
D2 Problem Description

Model name: HCS Base Seat

Picture
What : NO.1 Bump
Defect mode: Bump , Poor surface ,
Surface white marks

When:
Date of notification – 17,July, 2017
NO.2 Poor Surface
 Was detected in which process:
Customer incoming Inspection

How much
Affected Lot # and Quantity :
Defect rate : around 52.25% NO.3 White Mark

Customer Information
Product Name
(Customer) Detected
Defect rate
Quantity
HCS Base Seat 151 52.25%
D3 Containment Actions

# Action Items
1 Check retain sample for the same/ similar defect mode, and than perform failure analysis before receive the
defect sample from Focus Light if there is any.
1.Re–inspection status : We have no stocks
2.We inspected the product that was shipped 11, August.

NO Inspected Q’ty (pcs) Defective Q’ty(pcs) Defective Rate(%) Remark

1 540 0 0

Result: We can’t find Mixing a part , bump and any defective part

Start & Due date : 11, August , 2017 Responsibility :S.Y. kim (QA.) Status/Result : Closed

2 Process Mapping and Process Variation checking result.

Result for Process mapping:

Action Items Who Due date Results

1. Checked the process history , manufacturing , Final Test and KOSTECSYS 19~20 July,2017 detected abnormality
packing process

We check our manufacturing process . But, We can find any abnormality

Start & Due date : 19~20-July. Responsibility : J.M, Jeong(QA) Status/Result : Closed
D3 Containment Actions
# Action Items
3 Material disposition for the parts at vendor site,

Location Impacted Q’ty (units) Disposition

Customer (Siward) inventory 354EA Return

Customer (Siward) WIP 0 N/A

Kostecsys inventory 0 N/A

Kostecsys WIP 0 N/A

On the way to Siward 0 N/A

Start & Due date : 28- July ,2017 Responsibility : G.H.Lee (Prod.) Status/Result : Closed
4 Recovery plan to support Focus Light production.
Result:
- Detail delivery plan :
We will plan to delivery improved product by corrective action from next Shipping order.

Start & Due date : Unknown Responsibility : Paul. Park(Sales) Status/Result : Open
D4 Root Cause Analysis
Fishbone Analysis

Machine Material

Bump, White Mark

Poor
Poor Cleaning
Cleaning Inspector
Inspector Mistake
Mistake

Method Man
D4 Root Cause Analysis
Fishbone Analysis
*.*. Fishbone
Fishbone factors
factors check
check result
result

4M Possible Root Cause Assessment Risk

Unstable machine Based on plating facility record, there are not detect any
Low
condition Abnormality
Machine
parameter For facility parameter, there are not detect any abnormality Low

Raw material For Raw material , there are not detect any abnormality Low
Material
Non woven fabric For Material for Packing we detect abnormality High

Unstable working
For the plating line, the unstable condition was not found Low
condition
Method
Regarding poor operation, there are detected any
Poor Cleaning High
abnormality.

Man Inspector mistake For inspected we detect abnormality High

D4 Root Cause Analysis
Defect Sample Analysis

1. Bump
■ Bump : We assume that the root cause is that mixing a part caused by Worker’s mistake

2. Poor Surface1
2.1) Picture Analysis(X20)

Spectrum1

Spectrum2

Picture 1 Spectrum 1 enlargement(X45)

Result : It seems to be damaged by another material
D4 Root Cause Analysis
EDAX Analysis( Poor Surface 1)

1.Spectrum 1 ( Damaged Zone.1) 2.Spectrum2 (normal zone)

C :7.78%
C : 49.83%

Si : 10.31% Au : 89.12%

Au : 3.22%
Ca :0.97 %
2. EDAX Analysis result :
1) It is detected C, Si ,O ,Na ,Cl, Ca and Au in Spectrum 1 and is detected C, Ni ,Cu, Au to spectrum 2,
The Important thing is that it is Si content of spectrum 1(10.31%) much higher than it of Si of spectrum 2(0.00wt%).
2) Content of Ca of spectrum 1 (0.97wt%) more higher it of spectrum 2(0.00wt%)
Au plating seems to be serious damaged because it is affected by another material
D4 Root Cause Analysis
Defect Sample Analysis

3. Poor Surface2
3.1) Picture Analysis(X20)

Spectrum3

Spectrum4

Result : We can see black spots as a little bit of leaning product. When Product is in horizontal status
Black spot is colored
D4 Root Cause Analysis
Defect Sample Analysis
4. White Mark
4.1) Picture Analysis(X20)

4.2 Optical Microscope Picture

Spectrum1

Result : Black mark seems to be contaminated by contact of another material

D4 Root Cause Analysis
EDAX Analysis( White Mark- Black Part )

1.Spectrum 1 ( Contamination Zone ) 2.Spectrum4 (normal zone)

C : 8.95% C : 5.46%

Au : 83.22% 86.51%

2. EDAX Analysis result :

The Important thing is that it is C content of spectrum 1(8.95%) much higher than it of C of spectrum 4(5.46wt%).
To be high C content of Spectrum 1 mean Black part is caused by using packaging material which already
have been contaminated
Actually, this is not white mark and black mark , We thought
D4 Root Cause Analysis
Root cause

1.Bump: We assume bump is caused mixing part by worker mistake

2. Poor Surface
1) We assume that that poor surface 1, 2)poor surface 2 is caused by poor cleaning
method

3. White Mark: Black mark is caused by using contaminated packaging

material(Non woven fabric)
D6 Verify Corrective/ Preventive Action

■ Corrective Action
1. Bump: 1) Designating clear zone for good and defective part , waiting for inspection
Before
Before After
After
Micro Scope
Defective Product

Good product
Waiting zone
There
There ss nothing
nothing clear
clear zone
zone for
for good
good ,,
contents
contents defective
defective and
and waiting
waiting inspection
inspection
contents
contents Designating
Designating Clear
Clear zone
zone
2) Implemented training
contents) How to use each zone training report

■ Corrective Action
We changed the intensity of ultrasonic and cleaning time
Before
Before After
After

Ultra Intensity
Intensity of
of Ultrasonic :: 1ST contents Ultra Intensity of Ultrasonic : 4th Stage
contents
contents
ST Stage
Stage contents
sonic Cleaning
Cleaning time:
time: 10Min
10Min sonic Cleaning time: 15Min
D6 Verify Corrective/ Preventive Action

■ Corrective Action
3. White mark: Change the packaging material

Before After

contents
contents Non woven fabric contents
contents Clean
Clean Paper
Paper for
for clean
clean room
room
D6 Implement Corrective/ Preventive Action

1. Mixing Part : We have been used clear zone after improvement

2. Check worker keep WI or not when process patrol inspection

1.WI is posted each facilities and worker keep the WI(Work instruction)
2. Product is inspected by inspection or Work instruction or mor

3. Change packaging material: We will plan to verify from next focus light order about
changing packaging material.
 D7 Recurrence Prevention
Item Yes/No Evidence if Yes
Fan-out No N/A
FMEA No N/A

Specification Yes Update relevant standard

Plan for Education No N/A

1.Change SOP(Red Letter Part)

Before After

Intensity of Ultrasonic : 1ST Stage Intensity of Ultrasonic : 1ST Stage

Cleaning time: 10Min Cleaning time: 10Min

2. Revised Control Plan

D7 Recurrence Prevention

3.Revised FMEA

D8 Approval

Name Position
Report Provided by JM. Jeong QA Group, Manager

Report Approved by KJ. Han CEO

GH. Lee Production Engineering group, Manager
MI. Heo R&D Director