Computer Architecture and Organization
Computer Architecture and Organization
and Organization
Chapter 1
Introduction
Chapter Overview
Peripherals Computer
Central Main
Processing Memory
Unit
Computer
Systems
Interconnection
Input
Output
Communication
lines
Structure - Top Level
Central processing unit (CPU): Controls
the operation of the computer and performs
its data processing functions; often simply
referred to as processor.
Main memory: Stores data.
I/O: Moves data between the computer and
its external environment.
System interconnection: Some
mechanism that provides for communication
among CPU, main memory, and I/O. A
common example system bus.
Structure - The CPU
CPU
Computer Arithmetic
Registers and
I/O Login Unit
System CPU
Bus
Internal CPU
Memory Interconnection
Control
Unit
Structure - The CPU
Its major structural components are as
follows:
Control unit: Controls the operation of the
CPU and hence the computer.
Arithmetic and logic unit (ALU): Performs
the computer’s data processing functions.
Registers: Provides storage internal to the
CPU.
CPU interconnection: Some mechanism
that provides for communication among the
control unit, ALU, and registers.
Structure - The Control Unit
Control Unit
CPU
Sequencing
ALU Login
Control
Internal
Unit
Bus
Control Unit
Registers Registers and
Decoders
Control
Memory
Structure - The Control Unit
2
MAINFRAME COMPUTERS’ IMAGES
2
The Von Neumann Machine
The stored-program concept attributed to the
ENIAC designers, most notably the
mathematician John von Neumann, who was a
consultant on the ENIAC project. Alan Turing
developed the idea at about the same time.
The first publication 1945 proposal by von
Neumann for a new computer, the EDVAC
(Electronic Discrete Variable Computer).
In 1946, von Neumann and his colleagues
began the design of a new stored-program
computer at the Princeton Institute for
Advanced Studies.
Von Neumann/Turing
Main memory storing programs and data.
ALU operating on binary data.
Control unit interpreting instructions from
memory and executing.
Input and output equipment operated by
control unit.
Princeton Institute for Advanced Studies.
(IAS)
Completed 1952.
Structure of Von Neumann Machine
Commercial Computers
The 1950s saw the birth of the computer
industry with two companies, Sperry and
IBM, dominating the marketplace.
1947 - Eckert-Mauchly Computer
Corporation
UNIVAC I (Universal Automatic Computer)
US Bureau of Census 1950 calculations
Became part of Sperry-Rand Corporation
Late 1950s - UNIVAC II
Faster
More memory
The Second Generation:
Transistors
The first major change in the electronic
computer came with the replacement of the
vacuum tube by the transistor.
The transistor is smaller, cheaper, and
dissipates less heat than a vacuum tube but
can be used in the same way as a vacuum
tube to construct computers.
The transistor is a solid-state device made
from Silicon (Sand)
Invented 1947 at Bell Labs
William Shockley et al.
Computer Generations
Transistors
Each new generation is characterized by
greater processing performance, larger
memory capacity, and smaller size than
the previous one.
The second generation saw the
introduction of more complex arithmetic
and logic units and control units, the use
of high level programming languages, and
the provision of system software with the
computer.
Transistor Based Computers
Second generation machines
NCR & RCA produced small
transistor machines
IBM 7000
DEC – 1957
Produced PDP-1
Microelectronics
Literally - “small electronics”
A computer is made up of gates,
memory cells and interconnections
These can be manufactured on a
semiconductor
e.g. silicon wafer
The Third Generation: Integrated
Circuits
In 1958 came the achievement that
revolutionized electronics and
started the era of microelectronics:
the invention of the integrated
circuit. It is the integrated circuit
that defines the third generation of
computers.
In this section we provide a brief
introduction to the technology of
integrated circuits.
The Third Generation: Integrated Circuits
The basic elements of a digital computer,
as we know, must perform storage,
movement, processing, and control
functions.
Only two fundamental types of
components are required gates and
memory cells.
A gate is a device that implements a
simple Boolean or logical function. Such
devices are called gates because they
control data flow in much the same way
that canal gates do.
The Third Generation: Integrated Circuits
The memory cell is a device that can store
one bit of data; that is, the device can be in
one of two stable states at any time.
By interconnecting large numbers of these
fundamental devices, we can construct a
computer. We can relate this to our four
basic functions as follows:
Data storage: Provided by memory cells.
Data processing: Provided by gates.
Data movement: The paths among components are
used to move data from memory to memory.
Control: The paths among components can carry
control signals.
Growth in CPU Transistor Count
Later Generations
Beyond the third generation there is
less general agreement on defining
generations of computers.
With the rapid pace of technology,
the high rate of introduction of new
products, and the importance of
software and communications as well
as hardware, the classification by
generation becomes less clear and
less meaningful.
Later Generations
Large-scale integration (LSI), more than 1000
components can be placed on a single integrated
circuit chip.
Very-large-scale integration (VLSI) achieved more
than 10,000 components per chip, while current
ultra-large-scale integration (ULSI) chips can
contain more than one million components.
SEMICONDUCTOR MEMORY The first application of
integrated circuit technology to computers was
construction of the processor (the control unit and
the arithmetic and logic unit) out of integrated
circuit chips.
Designing For Performance
Year by year, the cost of computer
systems continues to drop
dramatically, while the performance
and capacity of those systems
continue to rise equally
dramatically.
Designing For Performance
Technological revolution has enabled the
development of applications of amazing
complexity and power.
For example, desktop applications that require
the great power of today’s microprocessor-based
systems include
Image processing
Speech recognition
Videoconferencing
Multimedia authoring
Voice and video annotation of files
Simulation modeling
Designing For Performance
Workstation systems now support
highly sophisticated engineering and
scientific applications, as well as
simulation systems, and have the
ability to support image and video
applications.
Performance Balance
While processor power has raced ahead at
breakneck speed, other critical components
of the computer have not kept up. The
result is a need to look for performance
balance: an adjusting of the organization
and architecture to compensate for the
mismatch among the capabilities of the
various components.
Nowhere is the problem created by such
mismatches more critical than in the
interface between processor and main
memory.
Performance Balance
Processor speed increased
Memory capacity increased
Memory speed lags behind processor
speed
Designing For Performance
Solutions
Increase number of bits retrieved at one
time
— Make DRAM “wider” rather than “deeper”
Change DRAM interface
— Cache
Reduce frequency of memory access
— More complex cache and cache on chip
Increase interconnection bandwidth
— High speed buses
— Hierarchy of buses
Designing For Performance
This includes the incorporation of
one or more caches on the
processor chip as well as on an off-
chip cache close to the processor
chip.
Increase the interconnect bandwidth
between processors and memory by
using higher-speed buses and by
using a hierarchy of buses to buffer
and structure data flow.
I/O Devices
Peripherals with intensive I/O demands
Large data throughput demands
Processors can handle this
Problem moving data
Solutions:
— Caching
— Buffering
— Higher-speed interconnection buses
— More elaborate bus structures
— Multiple-processor configurations
Typical I/O Device Data Rates
Key is Balance
Processor components
Main memory
I/O devices
Interconnection structures
Improvements in Chip Organization and
Architecture