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Phase Diagram: Development of Microstructure

The document describes the development of microstructure in an isomorphous copper-nickel alloy during equilibrium and non-equilibrium cooling. During equilibrium cooling, the alloy maintains phase equilibrium at each temperature step as it cools slowly. During non-equilibrium cooling, insufficient time for diffusion results in compositional changes across grains from the center outward and segregation of elements, with grain centers richer in nickel than boundaries.

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0% found this document useful (0 votes)
76 views

Phase Diagram: Development of Microstructure

The document describes the development of microstructure in an isomorphous copper-nickel alloy during equilibrium and non-equilibrium cooling. During equilibrium cooling, the alloy maintains phase equilibrium at each temperature step as it cools slowly. During non-equilibrium cooling, insufficient time for diffusion results in compositional changes across grains from the center outward and segregation of elements, with grain centers richer in nickel than boundaries.

Uploaded by

senthilkumar ts
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Phase Diagram

Development Of Microstructure
DEVELOPMENT OF MICROSTRUCTURE IN
ISOMORPHOUS ALLOYS

Equilibrium Cooling

• Cooling occurs very slowly, in that phase equilibrium is


continuously maintained.
• Let us consider the copper–nickel system, specifically an
alloy of composition 35 wt% Ni–65 wt% Cu as it is cooled
from 1300˚C.
Schematic representation of the development of microstructure
during the equilibrium solidification of a 35 wt% Ni–65 wt% Cu
alloy
• At 1300˚C, point a, the alloy is completely liquid (of
composition 35 wt% Ni–65 wt% Cu)
• Point b, 1260˚C the first solid α begins to form, which has
~
a composition dictated by the tie line drawn at this
temperature [i.e., 46 wt% Ni–54 wt% Cu, noted as α (46 Ni)]
• The composition of liquid is still approximately 35 wt% Ni–65
wt% Cu [L(35 Ni)]
• At 1250˚C, point c, the compositions of the liquid and α
phases are 32 wt% Ni–68 wt% Cu [L(32 Ni)] and 43 wt% Ni–
57 wt% Cu [α(43 Ni)], respectively.
• The solidification process is virtually complete at about
1220˚C, point d; the com-position of the solid α is
approximately 35 wt% Ni–65 wt% Cu
• The last remaining liquid is 24 wt% Ni–76 wt% Cu
• Upon crossing the solidus line, this remaining liquid
solidifies
Non equilibrium Cooling
• Conditions of equilibrium solidification and the development
of microstructures, as described in the previous section, are
realized only for extremely slow cooling rates.
• The reason for this is that with changes in temperature,
there must be readjustments in the compositions of the
liquid and solid phases
• These readjustments are accomplished by diffusional
processes
• Diffusion is a time-dependent phenomenon
• To maintain equilibrium during cooling, sufficient time must
be allowed at each temperature for the appropriate
compositional readjustments.
Non equilibrium Cooling
• Let us begin cooling from a temperature of about 1300˚C;
this is indicated by point a in the liquid region. This liquid
has composition of 35 wt% Ni–65 wt% Cu.
• At point b (approximately 1260˚C), α-phase particles begin
to form, which, from the tie line constructed, have a
composition of 46 wt% Ni–54 wt% Cu.
• Upon further cooling to point c (about 1240˚C), the liquid
composition has shifted to 29 wt% Ni–71 wt% Cu;
furthermore, at this temperature the composition of the α
phase that solidified is 40 wt% Ni–60 wt% Cu.
• However, because of diffusion in the solid α phase is
relatively slow, the α phase that formed at point b has not
changed composition appreciably—that is, it is still about 46
wt% Ni—and the composition of the α grains has
continuously changed with radial position, from 46 wt% Ni at
grain centers to 40 wt% Ni at the outer grain perimeters.
• At point d ( 1220˚C) and for equilibrium cooling rates,
~
solidification should be completed. However, for this non
equilibrium situation, there is still an appreciable proportion
of liquid remaining, and the α phase that is forming has a
composition of 35 wt% Ni also the average α-phase
composition at this point is 38 wt%.
• Non equilibrium solidification finally reaches completion at
point e (~1205˚C). The composition of the last α phase to
solidify at this point is about 31 wt% Ni; the average
composition of the α phase at complete solidification is 35 wt
% Ni.
• The inset at point f shows the microstructure of the totally
solid material.
Consequences under non equilibrium
conditions.
• Segregation- Concentration gradients are established
across the grains (the distribution of the two elements within
the grains is no uniform)
• Coring- The center of each grain, which is the first part to
freeze, is rich in the high-melting element (e.g., nickel for this
Cu–Ni sys-tem), whereas the concentration of the low-melting
element increases with position from this region to the grain
boundary.

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