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Cooling of Electronic Component Using Nanoparticle

This document discusses cooling enhancement of disc shaped electronic components using nanofluids. It presents the objectives of effectively cooling an electronic component using nanofluid, finding the best nano particle and base fluid combination for cooling, efficiency at different temperatures, and efficiency at different mass flow rates. The methodology involves reviewing literature to determine the optimum microchannel design, component shape, and nanofluid. Experiments will be conducted using ANSYS Fluent to simulate different nanofluids, volume fractions, temperatures, and shapes. Physical testing will machine microchannels into a disk and test different nanofluids prepared in the lab for cooling performance while varying parameters. The design of the disk and collector channel are also presented.

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Adarsh s nair
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34 views20 pages

Cooling of Electronic Component Using Nanoparticle

This document discusses cooling enhancement of disc shaped electronic components using nanofluids. It presents the objectives of effectively cooling an electronic component using nanofluid, finding the best nano particle and base fluid combination for cooling, efficiency at different temperatures, and efficiency at different mass flow rates. The methodology involves reviewing literature to determine the optimum microchannel design, component shape, and nanofluid. Experiments will be conducted using ANSYS Fluent to simulate different nanofluids, volume fractions, temperatures, and shapes. Physical testing will machine microchannels into a disk and test different nanofluids prepared in the lab for cooling performance while varying parameters. The design of the disk and collector channel are also presented.

Uploaded by

Adarsh s nair
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPTX, PDF, TXT or read online on Scribd
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COOLING ENHANCEMENT OF

DISC SHAPED ELECTRONIC


COMPONENTS USING NANO
FLUID  FLUID
• PROJECT SUPERVISOR S7 ME 1 GROUP 12
• MR .MELVIN JACOB ADHARSH RAJ
• ASSISTANT PROFFESOR BINOSH M 
• MBCET ASWINTH S KUMAR
ADARSH S NAIR
• Electronic components like processors are rapidly
increasing day by day on electronic devices
• With the current market resistance to widely embrace
advanced methods such as liquid cooling, air cooling will
continue to be a popular choice
INTRODUCTI • Electronic systems, from a large computer to a small desktop are a
ON collection of various materials embedded in a multitude of
geometrical configurations. This combination, along with the
exponential increase in power dissipation and packaging density,
has made cooling problems challenging. 

• All electronic devices and circuitry generate excess heat and thus


require thermal management to improve reliability and prevent
premature failure.
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS

A comparative study on • The nanofluid 0.5% of AL203 in water was


best configuration for found to be  most suitable for heat
heat enhancement using extraction in porous blocks, straight free
nanofluid channels and wavy free channels
• It had the lowest friction coefficient and
highest thermal efficiency for porous and
Clihttps://doi.org/ wavy 3 channel
10.1016/
j.ijft.2020.100041ck to
add text
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​

Heat Transfer in
Nanofluids—A Review Ratio of thermal conductivity of
nanoparticle to base fluid had
maximum value for the combination
https://doi.org/10.1080/0 ‘Cu0 and ethylene glycol’ with
1457630600904593
increasing volume fraction of nanofluid.
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​

Impact of nanoparticle • Nanoparticle shape like


shape on platelets and cylinders have
thermohydraulic comparatively  higher heat
performance of a transfer coefficient, h than Os
nanofluid in an enhanced and bricks.
microchannel heat sink • However, the pressure drops in
for utilization in cooling of pellets and cylinders is so high
electronic components that the ratio of heat transfer to
pressure drop of pellets and
https://doi.org/10.1016/j. cylinders is very low as
cjche.2020.11.026
compared to that of bricks and
Os
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​


• The thermal stresses and cooling
Vascularization for performance of a circular plate can be
cooling and reduced improved simultaneously by embedding
thermal stresses vascular cooling channels with increasing
volume fraction.
• Mechanical strength and cooling
doi:10.1016/ performance improve as the design changes
j.ijheatmasstransfer.2014 from radial to tree-shape
.09.027
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​

Constructal design of • Dendritic channels are not advisable due to


reverting microchannels pressure drops at forks and difficulties in
for convective fabrication
cooling of a circular disk •  Proposes radial microchannels over dendritic
ones
https://doi.org/10.1016/j.ij
thermalsci.2011.01.014
PROBLEM STATEMENT

• Several methods are employed for cooling electronic components


today which include heat sinks, thermoelectric coolers, forced air
systems and fans, heat pipes and others.
• Machining microchannels into electronic components and passing
nanofluids through them is one such method.
• However, temperature range, nano particle shape, base fluid
type, particle - base combinations and mass flow rate have not yet
been analysed simultaneously.
OBJECTIVES

• Effective cooling of a electronic component


using nanofluid

• To find the best combination of nano particle


and base fluid for cooling purpose

• To find efficiency at different cooling


temperatures

• To find efficiency of cooling at different mass


flow rates
METHODOLOGY

Step 1 – Refer journals  and literatures to find optimum design for microchannel, electronic
component disk shape and nanofluid

Step 2 – Find effective nanofluid mixture for cooling electronic component made of Silicon
of various shapes like slab, disc, cubic using ANSYS Fluent software.
- By altering boundary conditions,different nanofluids ,volume fraction and temperatures

Step 3- Plotting graphs based on the above results obtained from ANSYS Fluent based on
the objectives
Step 4- Machine microchannel into disk from VSSC  using the dimensions provided

Step 5 –   Preparation of different  nanofluid  (cu0 + ethylene glycol and al203 +


ethylene glycol )in  lab at correct volume fraction 

Step -6  - Suitable pressure sensor ,temperature sensor ,small portable pump
and related equipment are made or manufactured

Step 7 -  Conduction of experiment and recording of observation and result


numerically and experimentally
DESIGN OF DISK
DESIGN OF COLLECTOR
              THANK YOU

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