Scribd
Upload
44 views43 pages

Bab 3

1. There are three main levels of interconnection in IC assembly: wire bonding, flip chip bonding, and tape automated bonding. 2. Wire bonding and flip chip bonding connect individual chips to packages or substrates, while tape automated bonding is used to connect packaged chips to printed circuit boards. 3. The document discusses the process and advantages/disadvantages of wire bonding and flip chip bonding. Wire bonding uses gold or aluminum wires to connect pads on the chip to the package, while flip chip bonding uses solder bumps or balls on the chip that are reflowed to directly connect the chip face-down to the substrate.

Uploaded by

ezad2206
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
44 views43 pages

Bab 3

1. There are three main levels of interconnection in IC assembly: wire bonding, flip chip bonding, and tape automated bonding. 2. Wire bonding and flip chip bonding connect individual chips to packages or substrates, while tape automated bonding is used to connect packaged chips to printed circuit boards. 3. The document discusses the process and advantages/disadvantages of wire bonding and flip chip bonding. Wire bonding uses gold or aluminum wires to connect pads on the chip to the package, while flip chip bonding uses solder bumps or balls on the chip that are reflowed to directly connect the chip face-down to the substrate.

Uploaded by

ezad2206
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
You are on page 1/ 43

UNIT 3

INTERCONNECTION IN
IC ASSEMBLY
Learning Outcome

After completing the unit, students should be able


to:
 Know the purpose to do IC interconnection
 List down the details about level interconnection
 Recognize and learnt the process and types of
wire bonding
 Learnt about Flip Chip interconnection, then list
the various types of flip chip and the advantages
or disadvantages of flip chip
LEVEL OF
INTERCONNECTION
Level 1
Level 1
Level 2
Level 3
Level 4
Level 5
Level 6
Wire Bond
Advantages:
 Highly flexible chip-to-package interconnection process
 Low defect rates or high yield interconnection processing (40 – 1000 ppm)
 Easily programmed or taught bonding cycles
 High reliability interconnection structure
 Very large industry infrastructure supporting the technology
 Rapid advances in equiptment, tools and material technology

Disadvantages
 Slower interconnection rates due to point-to-point processing of each
wirebond
 Long chip-to-package interconnection lengths, degrading electrical
performance
i. Larger footprint required for chip to package interconnection
ii. Potential for wire sweep during encapsulation overmolding
Gold Ball Bonding

Advantage :

1. The wire comes out of the ball at any angle, thus making it
easy to wire in high-speed x-y motion of the bonding head

Parameter :

1) Chip bond made under force of <100g at 150degree with


ultrasonic excitation 60 – 120 kHz
2) Cycle time < 20ms for thermosonic bonding
3) Start with ball at end of wire
Gold Ball Bonding
Capillary
Gold Ball Bonding
Gold Ball Bonding
Wedge Bonding
Wedge Bonding

 The wedge bonding process requires that the flat wedge


bonding tool, after forming the first wedge bond, must
traverse straight from the first to the second bond,
without changing angle, so that the wire stays under the
foot of the wedge bonding tool as the wire pays out. For
this reason, either the tool or the bonding table holding
the chip must rotate in order to fan out each successive
wire from the chip to the lead frame or circuit.
 This condition is necessary to provide this radial fan out
of the bonded wires to prevent buckling and wire
fracture during the bond cycle.
Wedge Bonding
Wedge Bonding
Cross Section IC
Exercise :

1) What level of interconnection that wirebonding


and flip chip stand?
2) Name three types of wirebonding.
3) List two major techniques of wirebonding and
name types that both techniques associated
of?
4) Give one advantage and disadvantage of
wirebonding process?
5) What are different between wedge wire
bonding and gold wire bonding?????
Flip Chip
What????
 Is a key technology for advanced packaging of microelectronic
circuits.
 The concept of flip chip, the interconnection is the connection of an
integrated circuit chip to a carrier or substrate with the active face
of the chip facing toward the substrate. Interconnection between
the chip I/O and substrate is achieved using a bump structure on the
chip and a bonding material, typically on the substrate, forming an
electrical interconnection between the chip and the substrate
 It allows attachment of a bare chip to a packaging substrate in a
face-down configuration, with electrical connections between the
chip and substrate via conducting “bumps.”
 Flip chip technology was first invented by IBM for mainframe
computer application in the early 1960s.
 1970, IBM called this manufacturing process a C4 process
(controlled collapse chip connection).
Flip Chip

There are various types of flip chip processes /


methods:
1) Soldering
2) Thermocompression
3) Thermosonic
4) Adhesives (isotropic, anisotropic,
nonconductive)
Flip Chip

3 Major step for flip-chip assembly:


1)”bump”
2)”face down”
3)Underfill
Underfill

Cross sections of flip chip joints without and with underfill material.
Underfill

Function of Underfill????

1)moisture&contaminants
2)Mechanically locks
3)Shear stress
Flip Chip

Flip chip bump (a) wire stud bump; (b) Plated Stud Bump; (c) Solder Bump
Flip Chip

Function of bumps:
1)Electrical connection
2)Thermal conduction
Examples of different types of flip chip joints
Flip Chip Bumping Process

There are three (3) types of flip chip bumping


process;
1) Evaporative
2) Electroplating
3) Screen printing
Flip Chip Bumping Process
1) Evaporative process in order to create bump at wafer or die.

i. Wafer Clean

ii. Evaporation of UBM through metal mask – (UBM material’s/Cr-Cu/Cu/Au

iii. Evaporation of High Pb solder through metal mask

iv. Reflow to form solder ball


v. Deposition of a Sn cap
Flip Chip Process Steps

i--Thermocompression /Thermosonic

1) Die preparing (testing, bumping, dicing).


2) Substrate input.
3) Pick, alignment and place.
4) Force, heat (300C for Au, end to end) &
ultrasonic vibration applied – similar to that in
wire bonding process: normally apply to rigid
substrate ie alumina or silicon.
Flip Chip Process Steps
Flip Chip Process Steps

ii—Soldering

1) Die preparing (testing, bumping, dicing).


2) Substrate preparing (flux application or solder paste
printing).
3) Pick, alignment and place.
4) Reflow soldering.
5) Cleaning of flux residues (optional).
6) Underfill dispensing.
7) Underfill curing.
Underfill application by
dispensing
Flip Chip Process Steps

iii--Adhesive flip chip process steps is similar to


adhesive die attachment process whereby it
combines the advantages of thin structures and
cost efficiency
 
The advantages of conductive adhesives:
1) Elimination of clean after the bonding process.
2) Low curing temperatures
3) Ease of processing
Flip Chip Process Steps
Exercise

1. Name types of flip chip process.

2. Give two advantage and disadvantage of flip


chip process?

3. List three (3) types of flip chip bumping


process:

You might also like