UNIT -V

RECENT TRENDS IN NON-

TRADITIONAL MACHINING
PROCESSES
 INTRODUCTION

• Recent developments in non traditional

machining process is the hybrid process. This
process was developed by combining the
advantages of two non traditional machining
processes and eliminating the limitations of those
processes.
 VARIOUS TYPES OF HYBRID PROCESS

1. Electric discharge diamond grinding (EDDG)

2. Electro chemical spark machining (ECSM)
3. Magneto rheological abrasive flow finishing
(MRAFF)
 MAIN PURPOSES OF
IMPLEMENTING HYBRID PROCESS
• It enhances volumetric material removal rate.
• Computer controls of the processes have good
results and better performance.
• Awareness of capabilities will resolve many
problems in machining.
• Application of adaptive control machining
becomes easier.
Electro chemical spark machining (ECSM)

• Electro chemical spark machining is a hybrid

process of electro chemical machining and
electric discharge machining. This process is
Unique because it is suitable for both
conducting and non conducting material.
• It is used for selective deposition,
microwelding and machining of special non
conductive material
 PRINCIPLE OF (ECSM)
• The anode and the cathode are immersed
inside the electrolyte. Due to potential
difference developed, hydrogen bubbles are
generated and thus spark is created between
the cathode and workpiece.
• This produces high energy that helps in
material removal or vapourization of material
take place as shown in figure
Electro chemical spark machining (ECSM)
ELECTRO CHEMICAL SPARK MACHINING
(ECSM)
ELECTRO CHEMICAL SPARK MACHINING
(ECSM)
 MATERIAL REMOVAL IN ECSM

• Melting and vapourisation

• Chemical reaction when proper electrolyte is
not selected.
• Cracks propagate through random thermal
stresses.
• Due to mechanical shock and cavitations
effect.
 PROCESS PARAMETERS IN ECSM

• A supply voltage ranges between 35 – 50 V.

• Cutting tool has a wire diameter of 200 nm.
• The workpiece used here is soda lime glass.
• The gap to be maintained between the cathode and
workpiece is around 50 – 500 m depending on the
type of application.
• The electrolyte solution is 14 – 20% of water and
sodium chloride.
• The table speed is 4 rpm.
 ELECTRICAL DISCHARGE DIAMOND
GRINDING (EDDG)
• Electric discharge diamond grinding process is
a spark erosion process used for precision
grinding. Spark is produced between metal
bonded grinding wheel and workpiece.
• Heat generated during sparking softens the
workpieces surface and grinding process is
easily abraded using diamond abrasive
particles.
ELECTRICAL DISCHARGE DIAMOND
GRINDING
Formation of Spark in an Abrasive
 BASIC CONFIGURATION OF EDDG
• When the workpieces is the electrically
conductive material
• When the workpiece is electrically
nonconductive material.
 MAIN PARAMETERS USED IN EDDG
• Wheel speed
• Current
• Pulse on time
• Diamond particle size
• Bond material
• Dielectric material
• Voltage
 FACTORS AFFECTING PROCESS
PARAMETERS OF EDDG
1. Wheel speed
2. Current
3. Pulse on time
Wheel speed
POLISHING
CURRENTPAD
 ADVANTAGES OF EDDG

• It can grind any conductive and non conductive

materials.
• Less corrosive effect is produced.
• This process involves continuous dressing and
declogging of the abrasive wheel and thus increases
the wheel life to 25%.
• Higher material removal rate than EDM
• Lower operating cost
• Produces higher accuracy
 DISADVANTAGES OF EDDG

• Recast layer is formed after grinding

• Possibilities of oil fires
• Wheels are fragile
 APPLICATION OF EDDG

• It is used in grinding of thin sections

• Grinding of high hardness materials such as
cermates, super alloys and metal matrix
composites.
 MICROMACHINING
• Micromachining is machining of miniature
components. It is also defined as removal of
material in the form of chips or debris having
the size in the range of micron with
dimensions greater than or equal to one micro
and smaller than or equal to 999 micron.
MICROMACHINING
 FEATURES OF MICROMACHINING
• Minimising energy and material use
• Faster devices
• Increased selectively and sensitivity
• It has improved accuracy and reliability
• It is basically concern with machining of
micro / nano components or material or
material removal at micro / nano level.
Classification of Advanced Micro
Machining Processes
 ADVANCED MECHANICAL MICRO
MACHINING PROCESSES
• The working principle of advanced mechanical
type micro machining processes are fine
abrasive particles with high kinetic energy bits
the workpiece at an angle.
 ADVANCED MECHANICAL MICRO
MACHINING PROCESSES

• Abrasive jet micromachining

• Abrasive waterjet micromachining
• Ultrasonic micromachining
ABRASIVE JET MICROMACHINING
• Abrasive jet micromachining works in the
same principle of abrasive jet machining (AJM)
• A high speed stream of mixture of fluid (air or
gas) with abrasive particle is injected through
the nozzle on the workpiece to be machined.
 Powder flowability and compactability depends on

• Particle size
• Size distribution
• Moisture content and
• Surface texture
Steps involved in abrasive jet micro
machining
Pressurized powder feed system
Laval nozzle – Inner view
MASS LOSS
EFFECT OF PROCESS PARAMETER IN AJMM

• Powder compaction
• Powder stratification
• Powder humidity
 ADVANTAGES AND DISADVANTAGES OF
AJMM
ADVANTAGES
• Shallow holes can be accurately machined.
• Machining of grooves with the use of mask pattern or
target material can be done.
DISADVANTAGES OF AJMM
• Low erosion rate
• Minimum thickness of the substrate should be 0.3 mm
or otherwise buckling of the plate occurs.
• Constant powder feeding is affected due to
compaction, stratification and humidity.
 APPLICATIONS OF AJMM

• Micro accelerometer beam

• Matrix of micro E-cores
• Capillary electro phores is chips
• 3D suspended microstructures
• 3D passive glass micro mixer.
ABRASIVE WATERJET MICROMACHINING

• Abrasive waterjet micromachining works in

the same principle of abrasive waterjet
machining.
• Abrasive waterjet cut by erosion. A million of
such particles impact on a workpiece per
second travelling with 2 times the speed of
sound for machining the work surface.
 COMPONENTS OF AWJMM
• Abrasive water jet generation
• Abrasive waterjet subsystem
• Abrasive waterjet machining centers.
generating abrasive waterjets
Cutting head of abrasive waterjet
 ABRASIVE WATERJET

• ultra high pressure water at 3000 to 6000 bar

• water speed is 750 m/s
ABRASIVE WATER JET SUBSYSTEM

• Ultra high pressure water feed system

• The cutting head
• Abrasive feed system
 Abrasive Water Jet Micro Machining
Centre

• Motion system - ball screw and linear motors.

• Machine structure
• Workpiece holding
• Human machine interface and control system
 ADVANTAGES AND DISADVANTAGES OF
AWJMM
ADVANTAGES OF AWJMM
• Alloy steel and all grades of stainless steel can be machined.
• Machining of layered materials such as rubber or polymer
bonded to metal can be cut.
• It can cur thicker material than a laser.
DISADVANTAGES OF AWJMM
• Difficult to machine metals like armour plating, titanium and
copper base alloys.
• High residual stresses are produced in thin and toughened
glass during machining.
 APPLICATIONS OF AWJMM

• Used in jewellery and craft markets

• Used in precision cleaning, peening to remove
and dismantle nuclear plants
• Used in cutting precision pocket milling,
turning and drilling.
ULTRASONIC MICROMACHINING PROCESS

• Ultrasonic micromachining process works in

the same principle of ultrasonic machining
process.
• Ultrasonic micromachining produces
ultrasonic vibration, when combined with a
abrasive slurry to create a accurate cavity of
any shape through the impact of fine grains.
Ultrasonic micromachining is a mechanical
process that it produces high quality surface.
Schematic arrangement of ultrasonic micromachining
Material removal in ultrasonic micro
machining
 ULTRASONIC MICROMACHINING HAS 7 BASIC COMPONENTS

• High frequency oscillating current generator

• The acoustic head
• Tool spindle mechanism
• Controlled axes
• The micro tool
• Abrasive slurry
• Workpiece
 FACTORS AFFECTING PROCESS PARAMETER

• machining rate
• surface finish
• machining accuracy
• toolwear
 PROCESS VARIABLES OF USMM
1.Amplitude of vibration = 5 μm
2. Workpiece material = silicon
3. Tool material = Tungsten
4. Tool size = 50, 100,150 μm
5. Abrasive grain type = polycrystalline diamond
powder
6. size = 1 – 3 μm
7. Total tool feed = 515 μm
 ADVANTAGES AND DISADVANTAGES OF
USMM

• Machining of any materials regardless of their conductivity

• Machining of semiconductor as silicon germanium
• Suitable for machining precise brittle materials
• Can drill circular or non circular holes in hard materials
• Less stress is produced because of its non thermal
characteristics
DISADVANTAGES
• Low material removal rate
• Tool wear is faster in USMM
• Machining area and depth is restrained in USMM.
 APPLICATIONS OF USMM

• Used for making press tool dies

• Drilling small holes in helicopter power transmission
shaft
• Drilling of diamond dies, machining of aluminium oxides
Al2O3
• Producing hollow cubes
• Used in surgical tools manufacturer for better
evaculation of chips
• Plague from the teeth are removed without any damage
THERMAL ADVANCED MICROMACHINING
PROCESSESS
• In thermal advanced micromachining intense heat is
produced and localized which increases the workpiece
temperature in a zone or beam diameter equal to its
melting and vapourization temperature.
• The material removal is at micro-nano level in form of
debris.
Types of thermal advanced micromachining
(i) Electric discharge micromachining
(ii) Electron beam micromachining
(iii) Laser beam micromachining
 Electric Discharge Micro Machining
• Electric discharge micromachining (EDMM)
works in the same principle of electric
discharge machining (EDM).
• EDM removes material by thermal erosive
action of electrical discharge (spark) produced
by a pulse DC power supply between anode
and cathode. The tool acts as the cathode and
the workpiece acts as the cathode and the
workpiece acts as the anode.
TYPES OF ELECTRODES AND THEIR MATERIALS
Types of dielectric fluids and its properties
Schematic arrangement of electric
discharge micromachining
Three stages involved in formation of spark
PROCESS PARAMETERS OF EDMM
• Mechanism of material removal by melting
and evaporisation.
• Material removal rate is between 0.6 to 6
mm3 /hr
• Dimensional accuracy is 2 μm (sinking EDM)
and 1 μm (wire EDM).
• Surface finish is 0.4 to 0.5 μm
 EFFECT OF PROCESS PARAMETERS ON
EDMM

• Dielectric - Water is used as dielectric which

provides good discharge repetition rate.
• Tool - Electrode wear can be reduced by using
diamond electrode.
• Workpiece
 ADVANTAGES AND DISADVANTAGES OF
EDMM
ADVANTAGE
• It is used for cutting complex or odd shape materials
that are electrically conductive.
• It is used in machining hardened materials
• It has high machining rate
• It has good dimensional accuracy and surface integrity.
DISADVANTAGE
• It is not suitable for high aspect ratio holes and
features.
 APPLICATIONS OF EDMM

• Used in drilling 6.5 μ holes in 50 μm plate

• Used in making 1.2 μ slots in 2.5 μm wall.
• Used in shaping microfluids mixer and channel
• Used in machining microgears or internal
gears.
 ELECTRON BEAM MICROMACHINING
PROCESS
• EBMM works on the same principle of EBM.
Electron beam micromachining uses a high
velocity stream, of electron focused on the
workpiece surface to remove material by
melting and vapourization.
 CONSTRUCTION AND WORKING

• The main components of EBMM are the electron gun,

the anode, cathode, magnetic lens and deflection
coils with a vacuum chamber.
• The anode applies a potential field that accelerates
the electron with voltage of approx 50000 to
200000volts to create velocity over 200000 km/s.
• The power is defined by the accelerating voltage and
the beam current which ranges from 100 μA to 1
Amps.
 CONSTRUCTION AND WORKING

• An electromagnetic lens reduce the area of the

beam to a diameter of 25 μm.
• This beam of fast moving electron gets focused
to 10 to 200 μm area at density of 6500
GW/mm2
• The pulse duration ranges from 50 μs to 10 ms
• This process is limited to thin parts in the range
of 0.2 to 6 mm thick.
Mechanism of material removal in drilling
of electron beam micro machining
PROCESS PARAMETERS OF EBMM

• The pulse time and beam current level of the pulse

ensure high reproductability.
• Beam current varies from 100 μA to 1 A and governs
the energy / pulse being supplied to workpiece.
• Pulse duration for EBMM ranges from 50 μs to 10 ms.
• The working distance and the focused beam diameter
are determined by magnitude of current.
• The permissible minimum distance between 2 drilled
holes is in order of 2 to 3 times the hole diameter.
 ADVANTAGES AND DISADVANTAGES OF EBMM

ADVANTAGES
• It is easy to modulate the electron beam
parameters
• High precision stresses on the workpieces are
relaxed due to rise in temperature of the material
DISADVANTAGES OF EBMM
• The process is conducted in vacuum
• Requirement of high energy
• The equipment is expensive
 APPLICATIONS OF EBMM

• Used for drilling and cutting of metals, non metals, ceramics and
composite
• Used to drill thousands of hole on the material both electrically
conductive and non conductive material
• Used in making fine gas orifices in space nuclear reactors.
• Used in drilling holes in wire drawing dies
• Used in metering holes in injector nozzle of diesel engine.
• Employed for pattern generations for integrated circuit fabrication
• Used in drilling small diameter holes 250 μm
• Used in drill holes with very high depth to diameter ratio.
LASEB BEAM MICRO MACHINING PROCESS

• Laser consists of an amplifying medium where

stimulated emission and amplification of light is
created.
• Mirrors are used as optical resonators and oscillation
occurs because of amplifying medium. An optical
resonator provides a feedback and a pump source to
input energy in the amplifying medium. Laser is
placed between suitable aligned mirrors.
• The types of lasers used for machining are CO2 laser,
excimer laser yattrium, Aluminium, sapphire laser.
 MECHANISM OF MATERIAL REMOVAL IN LBMM

1. Direct writing
2. Mask projection
3. Interference technique
• specific power consumption - 1000 W/mm3/min
• MRR - 5 mm3/min
Laser direct writing technique
Mask Projection Technique and
Laser Interference Technique
Laser and Material Interaction Process
 PROCESS PARAMETERS OF LBMM

• Mechanism of material removal by melting and vapourization

• Medium – normal atmosphere
• Tool – High power laser beam
• Maximum MRR – 5 mm3 /min
• Specific power consumption = 100 W/mm3 min
• Material – All material except material of high reflectivity
(Aluminum and copper)
• Shape applications – drilling five holes
• Limitation – very high power consumption cannot machine
materials with high heat conductivity and reflectivity
 ADVANTAGES AND DISADVANTAGES OF LBMM

ADVANTAGES OF LBMM
• This process is forceless and contactless
• Minor heat affected zone
• machining is free from burr and bulging
• No additional tooling cost by wear
• Material removal rate is controllable.
DISADVANTAGES OF LBMM
• Very high power consumption
• It cannot machine materials of high
• High conductivity and reflectivity
• Not suitable for Aluminium and copper
• The equipment required for micromachining is very costly
• Need highly skilled operators to machine
 APPLICATIONS OF LBMM

• It is used in machining threads in a single poly fibre.

• Machining of microholes and microchannels on
integrated chips.
• Micro cutting in tungsten pin using 511 nanometer using
ND laser
• Micro fluidic devices in silicon showing laser drilled
holes and connecting channels
• Micro machined letters on a single human hair
• Cutting of 1mm tube cutting, 100 μm wide V grooves
 ELECTRO CHEMICAL MICROMACHINING
PROCESS
• Electro chemical micromachining works in the
same principle of Electro chemical machining.
• Faraday’s law of electrolysis states that the
amount of substance deposited or dissolved in
proportional to the quantity of electricity that
is passed through the electrolyte.
Schematic Arrangement of ECMM
 Electrolyte of ECMM
• Electrolyte are basically two types.
• Passive electrolyte containing oxidizing anions
(sodium nitrate, sodium chloride)
• Non passive electrolyte containing aggressive
anions (sodium chloride)
 Inter Electrode Gap
IEG – Inter Electrode Gap
• In ECMM process, the IEG is kept in range of 6 -15μm.
• Methods of monitoring and measuring the IEG is during
pulse of time of 0.1 to 5ms.
• Machining accuracy is directly proportional to the inter
electrode gap size.
Micro Tool Design and Fabrication
• The computer based tool design for ECMM is feasible,
economical and time saving one.
• Micro tools are fabricated using electro chemical etching
and wire electro discharge grinding as shown in figure
Anodic Reaction and Current Efficiency
Current Distribution and Shape Evolution

Through Mask ECMM – 3scales are considered

• Workpiece scale – geometry of the workpiece
can be controlled by the current distributions
• Pattern scale – Current distribution depends
upon the spacing of the features and their
geometry
• Feature scale – shape is evaluated through the
current distribution.
 EFFECT OF PROCESS PARAMETERS ON
ECMM

• Nature of power supply

• Inter electrode gap
• Concentration, temperature and electrolyte
flow.
• Microtool feed rate
 ADVANTAGES AND DISADVANTAGES
OF ECMM
ADVANTAGES
• Precision manufacturing of miniature
components
• Production of high accuracy holes.
DISADVANTAGES
• Material removal rate is very low
• The equipment used is of high cost
 APPLICATIONS OF ECMM

• 3D micromachining of microstructure in copper

sheet used in electronic circuit board
• Smooth surface and sharp borders are machined in
titanium surfaces by using mask ECMM
• Manufacture of nozzle plate for inkjet printer heads.
• Use in aerospace, automobile and other heavy
industries for shaping, sizing, deburring and finishing
operation.