Thermal Testing and Verification Part2
Thermal Testing and Verification Part2
Thermal Testing
Part 2
1
Part 2 Roadmap
Development Subsystem
Testing Testing
Space
Test Lessons Testing
Environment
Simulation Planning Learned Checklist
2
Introduction
3
Overview
5
What is considered a “unit”?
6
Approaches to Unit Test Temperatures
MIL-STD- JPL Commercial Programs
1540 (Different Contractors)
GSFC
Qualification Margin
Acceptance Margin
Thermal
Model
Flight Allowable
Temperature
Margin
Prediction
Range Thermal Uncertainty
Margin
7
Establishing Unit Level Test Temperatures
Qualification
Design Test Hot
Protoqual Hot
Acceptance Hot
------------
5 to11°C
Min/Max
Model -----------
Temperature 5 to 11°C OR 25 to 30% Acceptance Cold
Predictions control authority Protoqual Cold
Qualification
Cold
8
Unit Thermal Cycling Test
9
Unit Thermal Cycling Overview
nitrogen. Conduction
Cooled
Heating Elements
Unit MLI Cooling
Cooled
Fans for circulation Cold
Unit
Coils
10
Unit Thermal Cycling Overview (cont.)
Ambient
Based on
minimum
expected
temperature
Increasing
temperature Required
cold
1 hr
6 hr 6 hr
First cycle Intermediate
cycles Last cycle
Notes:
1. Operation is continuous except the component is turned off prior to cold and hot start.
2. To facilitate cool down, the component may also be turned off during cool down at
temperatures below the minimum expected temperature.
12
Hot and Cold Temperature Plateau
Hot Operational
Thermal Dwell Soak Cold
Test
Start
Tolerance
Thermal Functional
Stabilization Test Thermal Functional
Stabilization Test
Test
Temperature
Tolerance Hot
Start
Thermal Dwell
Unit
Operating Thermal Soak
Time
13
Unit Thermal Vacuum Test
14
Unit Thermal Vacuum Overview
Demonstrates the ability of the unit to perform in an
appropriate thermal environment (temperature and
vacuum).
16
Unit Thermal Vacuum Test Configuration
17
Unit Thermal Vacuum Test Configuration (cont.)
Conduction
Cooled
Unit
Heating Elements
MLI Cooling
Heating and cooling Cooled
Unit
Coils
Cold
capability controlled on Plate
Circulating
chamber walls and cold Air
plates
Vacuum Baffle
Coolant In Coolant Out Pump Insulation
18
Unit Test Requirements
19
Test Requirements for Electronic Units
*GSFC allows ambient pressure testing with 50% cycle increase plus PF margin of 25C or acceptance
margin of 20C and 6 hour soaks at plateaus
21
Test Requirements for Electronic Units (cont.)
22
Test Requirements for Electronic Units (cont.)
23
Example of Tailored Temperature Requirements
-200 -180 -160 -140 -120 -100 -80 -60 -40 -20 0 20 40 60 80 100 120
Temperature (Degrees C)
24
Testing of Non-electronic Units
25
MilStd 1540 Test Requirements for Various Units (1)
Electronic or
Components
Solar Panel
Mechanical
Propulsion
Equipment
Equipment
Equipment
Equipment
Assembly
Structural
Electrical
Pressure
Thruster
Antenna
Valve or
Thermal
Moving
Battery
Optical
Vessel
Test
26
Unit Testing of Moving Mechanical Assemblies
27
Unit Testing of Moving Mechanical Assemblies (cont.)
29
Unit Testing of Antennas (cont.)
30
Unit Testing of Solar Arrays
31
Unit Testing of Solar Arrays (cont.)
32
Unit Testing of Batteries
33
Unit Testing of Batteries (cont.)
34
Unit Testing of Batteries (cont.)
35
Unit Level Thermal Testing Summary
Three tests:
Thermal vacuum
Thermal cycling
Burn-in
Three functions:
Environmental stress screening
Performance verification
Survival and turn-on capability demonstration
37
Development Testing
Required to:
Validate new design concepts or the application of
proven concepts to new configurations.
Assist in the evolution of designs from the
conceptual to operational phase.
Reduce risks associated with new flight hardware.
Investigate problems or concerns that arise after
successful qualification.
38
Development Testing
Objectives:
39
Development Testing (Cont’d)
40
Thermal Balance Development Test
Two objectives:
To obtain thermal data for the verification of
analytical thermal models.
To verify the thermal control subsystem and
hardware.
41
Thermal Balance Development Test (cont.)
42
Deployment Mechanism Development Test
43
Deployment Mechanism Development Test (cont.)
It is common for deployment tests to be specified for
deployment mechanisms to show operation.
Vacuum conditions
Hot and cold environment
Changing temperature environment
Concerns:
Differential expansion of materials causing failure to
deploy.
Thermal gradients causing binding.
Material, adhesive or lubricant degradation at extreme
temperatures.
44
Heat Pipe Development Tests
46
Subsystem Testing
47
Subsystem or Payload Testing
48
Subsystem or Payload Testing (cont.)
Temperature range:
50
Test Requirements for Electronic Subsystems (cont.)
51
Subsystem Test Example – MILSTAR EHF Antenna
Spot Beam Antennas (2) Crosslink Antenna
EHF Test Issues
Variable Conductance
EHF Antenna Heat Pipes (Y-Z Plane)
52
EHF Subsystem-Level Test Issue Solution
Constant Conductance
Heat Pipe
High Thermal
Conductance Bracket
(Test Only)
Radiator Panel
Variable Conductance
Heat Pipes
53
EHF Subsystem-Level Thermal Test Hardware
Liquid Nitrogen Cold /
Heater Plates
54
Concluding Remarks for Part 2
55
Conclusion of Part 2
56