CENTRAL

PROCESSING
UNIT
COMPONENTS AND GENERATION
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Central Processing Unit

The CPU (Central Processing Unit) is
often referred to as the "brain" of a
computer. It performs most of the
processing inside a computer,
executing instructions from programs
through basic arithmetic, logic, control,
and input/output operations.
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Types of
CPU
Desktop CPUs: Typically, more powerful and designed
for general computing, gaming, or workstations (e.g.,
Intel Core, AMD Ryzen).

Mobile CPUs: Found in smartphones and laptops,

optimized for power efficiency (e.g., ARM processors
like Qualcomm Snapdragon).

Server CPUs: Designed for high-performance tasks

and server environments (e.g., Intel Xeon, AMD
EPYC).

Sunday, November 10, 2024 Central Processing Unit

 Core Components of a
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CPU:
ALU (Arithmetic Logic Unit): Handles all
arithmetic and logical operations (e.g., addition,
subtraction, comparisons).

CU (Control Unit): Directs the operation of the

processor. It tells the computer's memory, ALU,
and input/output devices how to respond to a
program's instructions.

Sunday, November 10, 2024 Central Processing Unit

 Core Components of a
5

CPU:
Registers: Small, fast storage locations within
the CPU used to hold temporary data and
instructions.

Cache: A small amount of very fast memory

located inside or very close to the CPU, used to
store frequently accessed data to speed up
processes.

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CPU Specification
Clock Speed: Measured in gigahertz (GHz), it
determines how many cycles per second the
CPU can execute. A higher clock speed
generally means faster performance.

Cores: Modern CPUs have multiple cores,

meaning they can perform multiple tasks
simultaneously. More cores are better for
multitasking and running complex
applications.

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CPU
Specification
Threads: A thread is a sequence of instructions that can be
managed independently by a scheduler. CPUs can handle
multiple threads, with some CPUs using hyper-threading to
effectively double the number of threads per core.

Instruction Set Architecture (ISA): The set of commands

the CPU understands, such as x86 or ARM.

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Intel
Genera
tion
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Process Node: 45nm

Features:
1st • First generation of Intel's Core series
(Core i3, i5, i7).
Generation • Introduced Turbo Boost and Hyper-
Threading (in Core i7).
(Nehalem) – • Integrated memory controller,
reducing latency.
2008/2009 • L3 cache introduced, shared between
Models:
cores.

Core i7-920, Core i5-750, Core

i3-530.
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Process Node: 32nm

2nd Features:
Generation • Significant architectural redesign
from Nehalem.
(Sandy • Integrated GPU (Intel HD Graphics) in
every CPU.
Bridge) – • Quick Sync introduced for hardware
video encoding/decoding.

2011 • Improved performance and power

Models:
efficiency.
• Core i7-2600K, Core i5-2500K.

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Process Node: 22nm (First to use Tri-

Gate transistors, also called 3D
transistors)

3rd Features:

Generation • Refinement of Sandy Bridge with

better power efficiency.
(Ivy Bridge) • Enhanced integrated graphics with
DirectX 11 support.
– 2012 • First Intel CPUs to support PCIe
3.0.
Models:
• Core i7-3770K, Core i5-3570K.

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Process Node: 22nm

Features:
4th Focused on mobile efficiency,
Generation improving power consumption for
laptops.
(Haswell) – Integrated voltage regulator for
improved power management.
2013 • Improved graphics performance
with Intel HD 5000 series.
Models:
• Core i7-4770K, Core i5-4670K.

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Process Node: 22nm

Features:
5th
Focus on reducing power
Generation consumption.

(Broadwell) Significant improvements in

integrated graphics performance.
• Limited release for desktops,
– 2014 primarily a mobile-focused
Models:
generation.

• Core i7-5775C, Core i5-

5675C
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Process Node: 14nm

Features:
6th Major redesign and support for new
Generation technologies like DDR4 memory.
Enhanced performance per watt,
(Skylake) – better than previous generations.
• Improved integrated graphics (Intel
2015 HD 530 and Iris Graphics).

Models:
• Core i7-6700K, Core i5-
6600K.
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Process Node: 14nm+

Features:
7th Incremental upgrade from Skylake,
Generation focused on higher clock speeds and
better 4K video playback.
(Kaby Lake) Optane Memory support introduced
for faster storage solutions.
– 2016 • Enhanced video encoding/decoding
performance (support for 4K HEVC,
VP9).
Models:
• Core i7-7700K, Core i5-7600K.

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Process Node: 14nm++

Features:
8th
Increased core counts: 6 cores in i5, 6
Generation cores/12 threads in i7.

(Coffee Major performance leap in multi-core

workloads.
• Improved Turbo Boost across more
Lake) – 2017 cores.
Models:
• Core i7-8700K, Core i5-
8600K.
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Process Node: 14nm++

9th Features:

Generation Up to 8 cores in mainstream i7 and i9

CPUs.

(Coffee Lake Introduction of Core i9 in the

mainstream platform.

Refresh) – First CPUs to hit 5 GHz boost clocks

on stock settings.
• Soldered TIM (Thermal Interface
2018 Material) for better heat transfer.
Models:
• Core i9-9900K, Core i7-9700K.

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10th Generation (Comet Lake and Ice Lake) – 2020

Comet Lake (Desktop) – 14nm+++

Ice Lake (Mobile) – 10nm

Features (Comet Lake):

• Up to 10 cores and 20 threads on the desktop.
• Hyper-Threading returned for all models (including Core i3 and i5).
• Thermal Velocity Boost to achieve higher boost clocks
Features (Ice Lake):
• First 10nm architecture from Intel, focusing on mobile processors.
• Gen 11 Iris Plus Graphics, supporting better integrated GPU
performance.
• Integrated Wi-Fi 6 and Thunderbolt 3 support.
Models:
• Core i9-10900K (Comet Lake), Core i7-1065G7 (Ice Lake).

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11th Generation (Rocket Lake and Tiger Lake) – 2021

Rocket Lake (Desktop) – 14nm

Tiger Lake (Mobile) – 10nm SuperFin

Features (Rocket Lake):

New Cypress Cove architecture backported from 10nm, improving IPC.
First desktop CPUs to support PCIe 4.0.
• Improved single-core performance but reduced maximum core count (down
to 8 cores).
Features (Tiger Lake):
Introduced Intel Xe Graphics for improved GPU performance.
Better AI and machine learning acceleration with DL Boost.
• First to support Thunderbolt 4 and USB 4.0.

Models:
• Core i9-11900K (Rocket Lake), Core i7-1185G7 (Tiger Lake).

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Process Node: 10nm (Intel 7)

12th Features:
First generation to use a hybrid architecture:
Generatio Performance cores (P-cores) and Efficiency
cores (E-cores).
n (Alder Support for next-gen technologies like DDR5
memory and PCIe 5.0.
Lake) – Significant performance uplift, especially in
multi-threaded and power efficiency tasks.
2021 • Up to 16 cores (8P + 8E) and 24 threads.
Models:
• Core i9-12900K, Core i7-12700K.

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Process Node: Intel 4 (7nm)

14th Features:
Generatio Tile-based architecture with different chiplets
for different tasks (CPU, GPU, I/O).
n (Meteor Significant IPC improvements and better
power efficiency.
Lake) – Continuation of hybrid architecture with
performance and efficiency cores.
Expected • Focus on AI acceleration and improved
integrated graphics performance with Intel
in 2024 Models:
Xe Gen 2.
• Core i9-14900K, Core i7-14700K.

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Process Node: Intel 4 (7nm)

14th Features:
Generatio Tile-based architecture with different chiplets
for different tasks (CPU, GPU, I/O).
n (Meteor Significant IPC improvements and better
power efficiency.
Lake) – Continuation of hybrid architecture with
performance and efficiency cores.
Expected • Focus on AI acceleration and improved
integrated graphics performance with Intel
in 2024 Models:
Xe Gen 2.
• Core i9-14900K, Core i7-14700K.

Sunday, November 10, 2024 Intel Generation

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AMD
Generation
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AMD A-Series APUs (Llano) – 2011

Process Node: Intel 4
(7nm)

Feature
s:

APU (Accelerated Processing Unit): Combined CPU and

integrated GPU (Radeon graphics) on the same die.
Focused on providing budget-friendly solutions with good
graphics performance.
• Entry-level to mid-range performance, with support for
DirectX 11.
Model
s:
• AMD A8-3850, A6-3650, A4-3400.

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AMD FX-Series (Bulldozer) – 2011

Process Node: 32nm

Feature
s:

AMD's first true 8-core CPUs for consumers.

Focused on high core count but had lower Instructions Per
Clock (IPC) compared to Intel's counterparts.
Based on the Bulldozer architecture, it featured a
"module" design (2 integer cores shared floating-point
units).
• Struggled to compete with Intel’s Sandy Bridge in
performance.
Model
s:
• FX-8150 (8-core), FX-6300 (6-core), FX-4300 (4-core).

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AMD FX-Series (Piledriver) – 2012

Process Node: 32nm

Feature
s:

A refinement of the Bulldozer architecture, focusing on

power efficiency and slightly better IPC.
Used in both desktops and servers.
• Multi-threading performance was strong due to the high
core count but still lagged Intel in single-core
performance.
Model
s:
• FX-8350 (8-core), FX-8320, FX-6300.

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AMD A-Series APUs (Kaveri) – 2014

Process Node: 32nm

Feature
s:

Improved over Llano and Trinity APUs.

Heterogeneous System Architecture (HSA) introduced for
better CPU-GPU collaboration.
Radeon R7 graphics integrated for better multimedia and
gaming performance on budget systems.
• First APU to support Mantle API, improving gaming
performance in supported titles.
Model
s:
• AMD A10-7850K, A8-7600.

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AMD Ryzen 1st Generation

(Zen) – 2017
Process Node: 32nm

Feature
s:
First appearance of the Zen architecture, a massive leap over
the Bulldozer and Piledriver generations.
Significant IPC improvements, putting AMD back into
competition with Intel after years of lagging behind.
High core counts: 8-core/16-thread CPUs in the Ryzen 7 lineup,
6-core/12-thread in Ryzen 5.
Focused on multi-threaded performance, great for productivity
and gaming.
• AM4 socket introduced, providing a long-term platform for
upgrades.
Model
s:
• Ryzen 7 1800X, Ryzen 5 1600X, Ryzen 3 1200.

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AMD Ryzen 2nd Generation (Zen+)

– 2018
Process Node: 12nm

Feature
s:
Improved upon the original Zen architecture with Zen+.
Higher clock speeds and better power efficiency due to the shift
to 12nm.
Precision Boost 2 and XFR2 improved clock speed management,
enhancing performance under load.
• Refined cache latencies and improved memory support.

Model
s:
• Ryzen 7 2700X, Ryzen 5 2600X, Ryzen 3 2200G.

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AMD Ryzen 3rd Generation (Zen 2)

– 2019
Process Node: 12nm

Feature
s:
Huge leap forward in terms of IPC and power efficiency.
Ryzen 3000 series was the first to match and, in some cases,
outperform Intel’s mainstream CPUs in both gaming and
productivity tasks.
Chiplet design introduced: CPU cores manufactured on 7nm,
while I/O die remained on 12nm, allowing for better scalability.
Support for PCIe 4.0, the first in mainstream CPUs.
• More cores and threads: Ryzen 9 series introduced up to 12-
core and 16-core CPUs.
Model
s:
• Ryzen 9 3900X, Ryzen 7 3700X, Ryzen 5 3600.

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AMD Ryzen 4th Generation (Zen 3)

Process Node: 7nm
– 2020
Features:

Major architectural overhaul with Zen 3, offering the highest

single-threaded performance AMD had ever delivered.
Redesigned core layout allowed for better communication
between cores, resulting in lower latency and higher IPC.
Zen 3 CPUs took the lead in gaming performance, overtaking
Intel's long-held crown.
Better power efficiency and performance across all workloads,
including gaming, productivity, and content creation.
• Ryzen 5000 series introduced up to 16 cores for mainstream
desktops.
Models:

• Ryzen 9 5950X (16-core), Ryzen 9 5900X (12-core),

Ryzen 7 5800X, Ryzen 5 5600X.

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AMD Ryzen 5th Generation (Zen 4)

– 2022
Process Node: 5nm (on CPU
cores)
Features:

Another significant leap with Zen 4, shrinking the process node

to 5nm on the CPU cores.
Introduced DDR5 memory and PCIe 5.0 support, pushing the
boundaries of platform speed and capability.
Increased power efficiency and performance, focusing on both
single-threaded and multi-threaded workloads.
Support for AVX-512 instructions for improved performance in
specific workloads like AI and scientific applications.
• AM5 socket introduced, bringing a new platform for future
upgrades.
Models:

• Ryzen 9 7950X (16-core), Ryzen 9 7900X (12-core),

Ryzen 7 7700X, Ryzen 5 7600X.

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AMD Ryzen 6th Generation (Zen 5) –

Expected in 2024
Process Node: 5nm (on CPU
cores)

Features
:

Continuing with the chiplet design, Zen 5 is expected to

bring further performance and power efficiency
improvements.
Potential focus on AI acceleration and more specialized
workloads with hardware optimizations.
Increased core counts, clock speeds, and architectural
improvements to maintain AMD’s lead in performance.
• Expected continued support for DDR5 and PCIe 5.0, and
possibly PCIe 6.0.
Models
:
• Likely to include Ryzen 9 8950X, Ryzen 7 8800X, Ryzen
5 8600X.
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