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21 views

Training PPT

Uploaded by

Pankaj
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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BRIEF TRAINING SESSION ABOUT SMT

PCBA Defect gallery PCBA 缺陷图库


In this training session we given
awareness to all the operators
regarding soldering defects which
generated during manual soldering
process.
在本次培训中，我们让所有操作员了解手工焊接过程中产生的焊接缺
陷
PCBA Defect gallery PCBA 缺陷图库

In this training session we given


awareness to all the operators
regarding component identification
and their value.

在本次培训中，我们让所有操作员了解组件识别及其价值
Basic Introduction of SMT Process & THT Process SMT
工艺及 THT 工艺基本介绍
SMT Process- SMT stands for surface mount technology, which is an automated PCB assembly process that places,
mounts, and solders electronic components to the surface of a printed circuit board.
SMT 工艺 - SMT 代表表面贴装技术，这是一种自动化 PCB 组装工艺，可将电子元件放置、安装和焊接到印刷电路板的表面。

Steps in the SMT process SMT 工艺步骤


•Step#1: Solder Paste Printing. 步骤 #1 ：焊膏印刷。
•Step#2: Solder Paste Inspection (SPI) 步骤 #2 ：焊膏检测 (SPI)
•Step#3: Chip Mounting. 步骤 #3 ：芯片安装。
•Step#4: Visual Inspection + Components Placement by Hand. 步骤 #4 ：目视检测 + 手动放置元件。
•Step#5: Reflow Soldering. 步骤 #5 ：回流焊接。
•Step#6: AOI (Automated Optical Inspection) 步骤 #6 ： AOI （自动光学检测）

THT Process-Through Hole Technology


Mounting (THT) is the process of mounting
on the PCB components with leads using
plated through holes.
THT 工艺 - 通孔技术安装（ THT ）是使用镀通孔将带引线的元件安装到
PCB 上的工艺。
Solder Paste Management & environmental Requirements
焊膏管理和环境要求
One of the most important parts of the surface mount assembly process is the application of solder paste to the
printed circuit board (PCB). The aim of this process is to accurately deposit the correct amount onto each of the
pads to be soldered. The squeegees are the tools used to apply the necessary force required to move the solder
paste across the stencil and on to the PCB.
表面贴装工艺中最重要的部分之一是将焊膏涂抹到印刷电路板 (PCB) 上。该工艺的目的是准确地将正确数量的焊膏涂抹到要焊接的每个焊盘上。刮刀是用于施加必要力的工具，以将焊膏移动到模板上并涂抹到
PCB 上。

Recommended storage temperature for solder paste is between 40°F and 50°F (4°C to 10°C). Storage at
temperatures above refrigeration will reduce shelf life and voids the guarantee. Such paste not used after open
the bottle after 6 hours.
焊膏的建议储存温度为 40°F 至 50°F （ 4°C 至 10°C ）。在高于冷藏温度的温度下储存会缩短保质期并使保证失效。开瓶后 6 小时后请勿使用此类焊膏。
PCBA Defect Awareness in SMT & THT Process
SMT 和 THT 工艺中的 PCBA 缺陷意识
Typical PCBA defects are soldering flaws like shorts, voids, bridging
and tombstoning, improper component placement, board damage,
adhesive issues, inadequate cleaning, Excess Solder, less solder,
short circuit, bill board, solder ball. Pad off and functional failures
from design or component problems.
典型的 PCBA 缺陷包括焊接缺陷，如短路、空洞、桥接和立碑、元件放置不当、电路板损坏、粘合剂问题、清洁不充分、
焊料过多、焊料不足、短路、广告牌、焊球。由于设计或元件问题导致焊盘脱落和功能故障。

Impact: Severely affect the product's appearance, affect the


reliability of the solder of the component, and affect the assembly
of the finished product.
影响：严重影响产品的外观、影响元器件焊接的可靠性、影响成品的组装。
Introduction Of ESD & their Protection
ESD 及其防护简介
In this training session we sharing the defination of ESD like, the transfer of an electrostatic charge between
bodies at different electrical potentials.
在本次培训中，我们分享了 ESD 的定义，例如不同电位的物体之间静电荷的转移。
Typed of Materials that Charge- Conductors, Insulators
带电材料类型 - 导体、绝缘体
Common Causes of ESD (ESD 的常见原因 -)-
Opening a common plastic bag 打开普通塑料袋
Removing adhesive tape from a roll or container 从卷筒或容器中撕下胶带
Walking across a floor and grabbing the door knob 走过一层楼，抓住门把手
Transporting computer boards or components around in their trays on non-ESD carts 使用非 ESD 推车将计算机主板或部件放在托盘中
运输
Sliding circuit boards on a work bench 在工作台上滑动电路板
Resistor Component & Their Colour Coding
电阻元件及其颜色编码
The resistor color code calculator makes it easy
to identify and select resistance and tolerance.
So basically we covered standard resistor
colour coding chart and how to evaluate the
resistor value through this method.

电阻颜色代码计算器可以轻松识别和选择电阻和公差。所以基本上我们涵盖了标准电阻颜色
编码表以及如何通过这种方法评估电阻值

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