Electroplati

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Electroplati
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● Electroplating is a process of coating deposition on a part,
immersed into an electrolyte solution and used as a cathode,
when the anode is made of the depositing material, which is
dissolved into the solution in form of the metal ions, traveling
through the solution and depositing on the cathode surface.
● A scheme of the electroplating of copper in the aqueous solution
of copper sulfate (CuSO4 ).
● Positively charged copper ion moves towards the negative cathode
and when it reaches the cathode surface it accepts two electrons,
converts to the copper atom and deposits on the cathodes surface.
Electroplating of
Cu
Faraday’s
Law
● The amount of the deposited material is directly proportional to the
amount of electric charge, passed through the circuit.
● Since amount of electric charge Q=I*t (I – electric current, t –
time), then the Faraday’s law may be expressed by the formula:
W = Itμ/(nF)
● Where W – weight of the deposited material;
● μ – weight of one mole of the metal;
● n - number of electrons transferred by the ion into solution (n=2 in
the above example);
● F – Faraday’s constant, F = 96485 Coulombs.
● Cathode efficiency is the ratio of the actual amount of the deposited
material to the theoretical amount that should be deposited.
● Current efficiency is the percentage of current, which is actually used
for the deposition at the cathode or for the anode dissolving (not
including the current used for the side reactions).
● Throwing power – uniformity of the thickness of a coating
deposited on irregularly shaped part.
● Leveling is ability of electroplating process to deposit smooth
uniform coating on the rough surface. Leveling is achieved by
addition of leveling agents into the electrolyte solution.
● Brightening is an ability of electroplating process to deposit bright
fine-structure coating. Brightening is achieved by addition of
brighteners into the electrolyte solution.
Factors affecting electroplating:

• The strength of electric current

• The concentration of the electrolyte

• The surface area of the electrodes

• Temperature of the process

• The distance between the cathode and the anode

ANODE AND CATHODE EQUATIONS:

Oxidation at anode:
Cu (s) → Cu2+ (aq.) + 2e–

Reduction at cathode:
Cu+ (aq.) + 2e– → Cu (s)

All electron-transfer reactions are considered oxidation/reduction. The substance gaining

electrons(oxidizing agent,or oxidant) oxidizes the substance that is losing electrons
(reducing agent, or reductant).

In the process, the oxidizing agent is itself reduced by the reducing agent. Consequently,
the reduction process is sometimes called electronation and the oxidation process is
called‘‘de-electronation
• Electrodeposition or electrochemical deposition (of metals or alloys) involves the
reduction of metal ions from electrolytes.

• At the cathode, electrons are supplied to cations, which migrate to the anode.In its
simplest form,
• the reaction in aqueous medium at the cathode follows the equation:
M^n+ + e^- M
• with a corresponding anode reaction.

• At the anode, electrons are supplied to the anions, which migrate to the anode. The
anode material can be either a sacrificial anode or an inert anode.

• For the sacrificial anode, the anode reaction is:

M M^n+ + e^-

• In this case, the electrode reaction is electrodissolution that continuously supplies the
metal ions.
Effects of electroplating:
• Electroplating changes the chemical, physical, and mechanical properties of the
workpiece.

• An example of a chemical change is when nickel plating improves corrosion resistance.

• Electroplating of acid gold on underlying copper- or nickel-plated circuits reduces

contact resistance as well as surface hardness.

• Copper-plated areas of mild steel act as a mask if case-hardening of such areas are not
desired.

• Tin-plated steel is chromium-plated to prevent dulling of the surface due to oxidation

of tin.
Electroplating
Methods
Mass plating

• A common type of mass plating method is known as barrel plating. In this method, the
material to be coated (substrate) is dipped in a barrel containing the metal salt
(electrolyte) and the anode of the coating metal.

• The barrel plating setup is highly economical for small parts that need a uniform
coating. As the barrel rotates, all the parts are cleaned, descaled and uniformly coated
to a greater extent compared to rack plating.

• Mass plating is generally used for small but robust parts such as nuts, bolts and
screws.
RACK PLATING:

• When the parts are larger than those suitable for mass plating, the rack plating method is
used. In rack plating, the parts are mounted on racks and immersed in the chemical
electroplating bath.

• The rack plating process reduces the damage to delicate or fragile parts and coats the
interior contours and deep crevices of parts, unlike mass plating.

• This process is, however, more expensive than mass plating. Rack plating is typically best for
large, fragile and complex parts that require a plating of gold, silver, tin, copper or nickel.
CONTINUOUS PLATING:

• The continuous plating process is performed on exceptionally long parts, such as

metal tubes, wires and strips.

• In the case of thin strips, this process is also known as the reel-to-reel plating process. In
this process, a long product is passed through the chemical bath at a specified rate. The
end product’s quality is controlled by manipulating the process parameters and the time
spent in the bath.

• The reel of the product to be coated is uncoiled at the initial station, and once it passes the
electrolyte/anode and gets coated, it is recoiled for easier storage and transport.
IN LINE PLATING:

• The in-line plating method uses an assembly line for the metal plating operation. The
metal passes through the various stations and automated machinery facilitates the
chemical reaction.

• Line plating is generally used for coating copper, zinc, chromium and cadmium. A
variety of substrates can be coated with these metals through line plating.

• This method is relatively cheaper than other methods because a lower amount of
chemicals is needed per piece.
Surface
Preparation
● Surface preparation is a series of cleaning treatments of the
substrate surface prior to the coating operation intended for
ensuring strong and uniform adhesion of the coating to the
substrate.
● Adhesion is a state of bonding a coating to the substrate
surface.
● Bonding strength (adhesive strength) is a tensile stress
(tensile load applied to the unit bonding area) required to
peel the coating from the substrate surface.
● Contaminants to be removed from the part surface
● Technologies of surface preparation
Contaminants to be removed from the part
surface
Mineral oils (Rust protection oils, Cutting fluids (coolants), greases,
etc.); Miscellaneous organic soils (paints, animal lubricants and
vegetable lubricants, fingerprints);

Polishing and buffing compounds;

Miscellaneous solid particles (dust, abrasive grits,

chips); oxides, scale, smut, rust.

 Technologies of surface
1.preparation
Mechanical cleaning
● Mechanical removal of solid particles, burrs, scales and oxides
from the part surface by abrasion, Abrasive blast cleaning,
vibratory finishing or Shot peening.
● Ultrasonic cleaning – scrubbing action produced by numerous
small vacuum cavities forming as a result of high frequency (20 –
45 kHz) sound waves traveling in a fluid, in which the part is
submerged.
● As a cleaning fluid aqueous solution of alkaline
detergents at room temperature is used.
● Ultrasonic cleaning is highly effective in removing solid
particles, dirt and smut.
● Spray cleaning – cleaning by aqueous solutions (alkaline or
2. Soak cleaning
● Solvent cleaning – removal of organic soils (mineral
oils, fingerprints etc.) by dissolving them in a
solvent.
● The solvent may be used in the liquid state, when the part
is either immersed into the solvent or sprayed by it.
● The solvent may also be used in the gaseous state
(vapor degreasing) when the soils are dissolved by the
solvent vapors.
● Use of some solvents like trichloroethylene and
trichloroethene (chlorinated hydrocarbons) is forbidden
or restricted in most of the world due to their adverse
● Emulsion cleaning
● Removal of soils by organic solvents dispersed in aqueous
solution, containing emulsifiers (surface active substance
preventing coalescence of the dispersed component).
● Emulsion cleaning is followed by alkaline cleaning to remove
the organic components of the emulsion from the part surface
prior to coating.
● Alkaline cleaning
● Removal of organic soils (mineral oils, fingerprints, wax etc.) and
some solid particles by hot alkaline solutions.
● The application methods are either immersion or spraying,
followed by water rinse.
● The work temperature of alkaline solutions is 130-190°F (50–84°C).
4. Acid activation
● Acid treatment is used to remove oxides, scales and
activate the metal surface of the part prior to coating.
● Mild acids (citric, phosphoric) are used for activation of
aluminum, zinc castings and other sensitive alloys.
● Strong acids (hydrochloric, sulfuric and nitric) are used
for activation of steels and stainless steels.
● Acid salts are used for more controllable and safe activation
process.