05_Internal Memory
05_Internal Memory
Internal Memory
Semiconductor Memory Types
Random-access
Read-write memory Electrically, byte-level Electrically Volatile
memory (RAM)
Read-only
Masks
memory (ROM)
Read-only memory Not possible
Programmable
ROM (PROM)
Erasable PROM
UV light, chip-level
(EPROM) Nonvolatile
Electrically
• RAM
—Misnamed as all semiconductor memory is
random access
—Read/Write
—Volatile
—Temporary storage
—Static or dynamic
Memory Cell Operation
Dynamic RAM
• Both volatile
—Power needed to preserve data
• Dynamic cell
—Simpler to build, smaller
—More dense
—Less expensive
—Needs refresh
—Larger memory units
• Static
—Faster
—Cache
Read Only Memory (ROM)
• Permanent storage
—Nonvolatile
• Microprogramming (see later)
• Library subroutines
• Systems programs (BIOS)
• Function tables
Types of ROM
• Hard Failure
—Permanent defect
• Soft Error
—Random, non-destructive
—No permanent damage to memory
• Detected using Hamming error correcting
code
Error Correcting Code Function
Advanced DRAM Organization
• Mitsubishi
• Integrates small SRAM cache (16 kb) onto
generic DRAM chip
• Used as true cache
—64-bit lines
—Effective for ordinary random access
• To support serial access of block of data
—E.g. refresh bit-mapped screen
– CDRAM can prefetch data from DRAM into SRAM
buffer
– Subsequent accesses solely to SRAM
Reading