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Module 3 Lecture 1 (1)

The document outlines the objectives and content of a course on Integrated Circuit (IC) Design Technology, focusing on various IC technologies such as NMOS, CMOS, and BiCMOS. It discusses the structure and benefits of ICs, including their miniaturization, performance, and reliability, as well as the classification of ICs based on integration scale and process nodes. Additionally, it highlights the significance of VLSI technology in modern electronic systems and the role of MOS processes in IC fabrication.

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Mohammad Sania 22221882101
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© © All Rights Reserved
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5 views

Module 3 Lecture 1 (1)

The document outlines the objectives and content of a course on Integrated Circuit (IC) Design Technology, focusing on various IC technologies such as NMOS, CMOS, and BiCMOS. It discusses the structure and benefits of ICs, including their miniaturization, performance, and reliability, as well as the classification of ICs based on integration scale and process nodes. Additionally, it highlights the significance of VLSI technology in modern electronic systems and the role of MOS processes in IC fabrication.

Uploaded by

Mohammad Sania 22221882101
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Course: Introduction to VLSI design (19EEC334)

Unit-III: IC Design Technology

Y.V.Appa Rao
Assistant Professor
Department of EECE.
GITAM Institute of Technology (GIT)
Visakhapatnam – 530045
Email: [email protected]
23/02/2025
Objectives
• To understand the essentials of various Integrated Circuit (IC)
Technologies, like NMOS, CMOS and BiCMOS
• To familiarize with the role of MOS VLSI Technology
• To gain knowledge on the fabrication processes for NMOS, CMOS and
BiCMOS technologies
• To understand qualitatively the pros and cons of various IC
technologies
• To familiarize with the concepts of enhancement mode MOSFET and
depletion mode MOSFET

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INTEGRATED CIRCUIT (IC)
• An IC is a small wafer usually Si, consisting of hundreds to millions of
transistors, resistors, and capacitors
• Components and interconnections are formed on the same substrate
 Highlights:
 Cost of the product
 Performance delivered
 Size (Miniaturization or Scaling)
 Can accommodate more complexity
 Lower operating voltages and power requirements
 Reliability
 Electrical matching among the components
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INTEGRATED CIRCUIT (IC) (contd.)
• An IC is a combination of interconnected circuit elements
inseparably associated on or within a continuous substrate
• The substrate is the supporting material upon or within which an
IC is fabricated or to which an IC is attached
• A wafer (or slice) is the basic physical unit used in processing and
it generally contains a large number of identical Ics
• The chip is one of the repeated ICs on a wafer

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4-inch P-type
Silicon wafer

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Nomenclature Active device count Typical functions

SSI (small scale integration) 1-100 Gates, op-amps, many


linear applications
MSI (Medium scale 100-1000 Registers, filters, etc.
integration)
LSI (Large scale integration) 1000-100,000 Microprocessors, ADCs etc.

VLSI (Very Large-Scale 100,000-1,000,000 Memories, Computers,


Integration) signal processors
ULSI (Ultra large-scale Billions of components System-on-chip(SoC)
integration)
GSI (Giga scale integration) Under research -

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Classification of ICs based on
process node
• Process node refers to a specifc semiconductor manufacturing
(fabrication) process and its design rules
 Some relevant definitions
 Minimum feature size: Minimum gate length (channel length of
a transistor) or minimum polysilicon width (channel width) or
minimum metal width
 Pitch: Minimum of the sum of the minimum width of a feature
and minimum spacing between similar features
• Histrically, the process node name referred to a few different
features of a transistor including the gate length as well as
Metal1 (M1) half pitch

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Process node or Technology node or
node

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Moore’s law
• The driving force behind process node scaling is Moore's law
• The no. of transistors on an IC doubles approximately
every two years

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VLSI Technology
 Every high performance and low power electronic systems explore
Microprocessors:16-bit microprocessors to current generation super
scalar computing architectures etc.
Memory chips: SRAM, DRAM & SDRAM chips etc.
Signal processors: Filters, Amplifiers, signal conditioning circuits and
power management etc.
 MOS driven
MOS processes are used for most VLSI scale circuits
BiCMOS process is also becoming more cost effective for VLSI circuits
Si is the most favorable substrate for fabricating CMOS VLSI circuits
23/02/2025
IC Technologies
I) With Active substrate
Silicon
MOS: NMOS, PMOS, CMOS
Bipolar: TTL, I2L, ECL, many linear ICs
Bi-CMOS: Combining CMOS and Bipolar technologies
GaAs
MESFET (Metal semiconductor field effect transistor)
Bipolar
For high volume IC (or high density)
23/02/2025

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