MEMS Class Orientation -
MEMS Class Orientation -
By
Department of ECE
Date: 17-02-2023
S6 ECE
MODULE 2
MECHANICAL
STRUCTURES
MODULE 1
MICROSENSORS MODULE 3
AND SCALING LAWS
MICROACTUATORS
MODULES
MODULE 5
MODULE 4
CHALLENGES IN
MICROFABRICATION
DESIGN AND
TECHNIQUES
PACKAGING
❖Review of Mechanical
concepts
MECHANICAL ❖General Stress Strain
STRUCTURES Relations
❖Mechanical Structures in
MEMS
❖ Beams, Cantilevers,
Diaphragms and Plates
❖Applications
❖ Scaling in geometry
❖ Scaling in electrostatic and
electromagnetic forces
SCALING LAWS ❖ Scaling in electricity and fluidic
dynamics
❖ Silicon and Silicon Compounds
❖ Photolithography
❖Ion implantation
STANDARD
MICRO FABRICATION ❖Diffusion
TECHNIQUES ❖Oxidation
❖Chemical vapour
deposition
❖ Etching
❖Bulk micro manufacturing
❖Surface micro machining
❖LIGA process
❖Microstereo lithography
Pressure sensors
Biosensors
RF MEMS
Pre-requisites
Tips
❖ Reference Books:
1.Chang C Y and Sze S M,VLSI Technology,McGraw-Hill,NewYork,
2000
2. Julian W Gardner, Microsensors: Principles and Applications,
John Wiley & Sons, 1994
3. Mark Madou, Fundamentals of Micro fabrication, CRC Press, New
York, 1997 .
❖Text Books:
1.Chang Liu, Foundations of MEMS, Pearson 2012
2.Tai-Ran Hsu, MEMS and Microsystems Design and Manufacture,
TMH, 2002
Web Links
1.https://www.researchgate.net/publication/
242686995_162_Principles_of_MEMS
2.https://www.imm.cnr.it/articles/new-materials-and-enabling-
technologies-mems-moems-and-nems