Intel HPC Update

Intel HPC Portfolio
and Roadmap Update
®

Gareth Tucker
IBM Technical Account Manager EMEA
INTEL CONFIDENTIAL

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Legal Disclaimers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL
OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND
CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or
characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without
notice. Do not finalize a design with this information.
Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain
Intel’s current plan of record product roadmaps.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
This document contains information on products in the design phase of development.
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without
notice.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copyright © 2013, Intel Corporation. All rights reserved.
*Other names and brands may be claimed as the property of others.

2
INTEL CONFIDENTIAL

This slide MUST be used with any slides removed from this presentation

Legal Disclaimers Continued
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. Go to: http://www.intel.com/products/processor_number
Intel® HT Technology available on select Intel® processors. Requires an Intel® HT Technology-enabled system. Consult your system manufacturer.
Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT
Technology, visit http://www.intel.com/info/hyperthreading.
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM). Functionality,
performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all
operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualization
No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system
with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible
measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit
http://www.intel.com/technology/security
Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select
Intel® processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more
information, visit http://www.intel.com/go/turbo
Intel® AES-NI requires a computer system with an AES-NI enabled processor, as well as non-Intel software to execute the instructions in the correct
sequence. AES-NI is available on select Intel® processors. For availability, consult your reseller or system manufacturer. For more information,
see http://software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/
Intel, Intel Xeon, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States
and other countries. Other names and brands may be claimed as the property of others

3
INTEL CONFIDENTIAL

This slide MUST be used with any slides with performance data removed from this presentation

Legal Disclaimers: Performance
Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as
measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other
sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on
the performance of Intel products, Go to: http://www.intel.com/performance/resources/benchmark_limitations.htm.
Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform
into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that correlates with the performance
improvements reported.
SPEC, SPECint, SPECfp, SPECrate. SPECpower, SPECjAppServer, SPECjEnterprise, SPECjbb, SPECompM, SPECompL, and SPEC MPI are trademarks of the Standard
Performance Evaluation Corporation. See http://www.spec.org for more information.
SAP and SAP NetWeaver are the registered trademarks of SAP AG in Germany and in several other countries. See http://www.sap.com/benchmark for more information.
Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or
configuration may affect actual performance.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and
MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the
results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the
performance of that product when combined with other products.

4
INTEL CONFIDENTIAL


Legal Disclaimers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY
SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH,
HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY,
OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE
INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change
without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on
request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific
computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you
in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Intel does not control or audit the design or implementation of third party benchmarks or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others
where similar performance benchmarks are reported and confirm whether the referenced benchmarks are accurate and reflect performance of systems available for purchase.
Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform into each of the specific benchmark results
of each of the other platforms, and assigning them a relative performance number that correlates with the performance improvements reported.
SPEC, SPECint, SPECfp, SPECrate. SPECpower, SPECjAppServer, SPECjbb, SPECjvm, SPECWeb, SPECompM, SPECompL, SPEC MPI, SPECjEnterprise* are trademarks of the Standard Performance Evaluation
Corporation. See http://www.spec.org for more information. TPC-C, TPC-H, TPC-E are trademarks of the Transaction Processing Council. See http://www.tpc.org for more information.
Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the
specific hardware and software you use. For more information including details on which processors support HT Technology, see here
Intel® Turbo Boost Technology requires a Platform with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall
system configuration. Check with your platform manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers
Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and
are subject to change without notice
Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps.
Xeon® is a trademark of Intel Corporation in the U.S. and/or other countries.
Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries. All dates and products specified are for planning purposes only and are subject to change without notice

INTEL CONFIDENTIAL


5


Optimization Notice
Optimization Notice

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations
that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction
sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any
optimization on microprocessors not manufactured by Intel.
Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors.
Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer
to the applicable product User and Reference Guides for more information regarding the specific instruction
sets covered by this notice.
Notice revision #20110804

6
INTEL CONFIDENTIAL

Intel Xeon Processor
E5-2600 v2 Product Family
®

®

Solve Real Problems, Deliver Real Results

INTEL CONFIDENTIAL

Intel® Xeon® Processor E5-2600 v2 Product Family

Tick-Tock Development Model:
Sustained Microprocessor Leadership
Intel® Core™
Microarchitecture

Intel® Microarchitecture
Codename Nehalem

Codename Sandy
Bridge

Xeon®
5300

Xeon®
5400

Xeon®
5500

Xeon®
5600

Xeon®
Xeon®
E5- 2600 E5- 2600 v2

65nm

45nm

45nm

32nm

32nm

New
Microarchitecture

New
Process
Technology

New
Microarchitecture

New
Process
Technology

TOCK

TICK

TOCK

TICK

Codename Haswell

Haswell

Future

22nm

22nm

14nm

New
Microarchitecture

New
Process
Technology

New
Microarchitecture

New
Process
Technology

TOCK

TICK

TOCK

TICK

Latest Micro-architecture on Leading Process Technology
8
INTEL CONFIDENTIAL


At the Heart of a Modern Data Center
Intel ® Xeon ® E5-2600 v2 product family
Efficient
Leading 22nm manufacturing process
reduces power usage. Supports Intel® Node
Manager & Intel® Data Center Manager
Software

Powerful
Up to 12 cores and 30MB cache
expected to deliver up to 30%1 more
performance in same power envelope
vs previous generation
.
2

Secure
Improved security with Intel® Secure Key &
Intel® OS Guard for additional HW embedded
security plus enhanced AES-NI

1 Source: Intel internal measurements. {SPECint*_rate_base2006, 28 March 2013, E5-26xxv2 (12C, 2.5GHz,) vs. E5-2600 (8C, 2.9Ghz, ). Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model.
Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps.. For
more information go to http://www.intel.com/performance

INTEL CONFIDENTIAL

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are
measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult
other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

9

Unrelenting Focus on Power Efficiency
Xeon E5-2600 v2

Active Power

Dynamic Power

Idle Power

Delivering up to 45%1 power
efficiency improvements
through enhanced fine grain
power controls and 22nm trigate process

Efficient Turbo that
intelligently adapts to peak
workloads conditions and
disengages when Memory
and I/O are the bottlenecks

Low leakage process
technology and power gating
technology contribute to Idle
Power of up to 23%1 lower
than previous generation

1. Source: Intel internal measurements: [Baseline Configuration and Score on SPECPower_ssj2013* benchmark. Idle power based on , Intel® Xeon ® processor E5- 26xx v2
(12C, 2.5GHz, 95W), 28 March 2013]. Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an
architecture simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do
not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. For more information go
to http://www.intel.com/performance

10
INTEL CONFIDENTIAL


REAL Performance Where it Counts
Xeon E5-2600 v2

50% MORE

IMPROVED

IMPROVED

NEW

cores / threads

faster memory

integrated IO (PCIe 3.0)

virtualization feature

50% MORE

~30%1 less

NEW

last-level cache

idle power

security features

1. Source: Intel internal measurements: [idle power, Intel® Xeon ® processor E5- 26xx v2 (12C, 2.5GHz, 95W), 28 March 2013]. Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture
simulator or model. Any difference in system hardware or software design or configuration may affect actual performance. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s
current plan of record product roadmaps. For more information go to http://www.intel.com/performance
* Other names and brands may be claimed as the property of others

other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
INTEL CONFIDENTIAL

11


Reduce Bottlenecks
with Intel® Integrated I/O

Better Together

Unleash the full I/O capabilities of Xeon® E5

with Intel® Ethernet X540 Server10GbE Adapter
or Intel® True Scale 7300 series HCAs

Increase I/O Performance

NETWORKING

APPLIANCES

Reduce I/O Latency

HPC

TRADING

STORAGE

LARGE SCALE
ANALYTICS

1. Source: Intel internal measurements of average time for an I/O device read to local system memory under idle conditions comparing Intel® Xeon® processor E5-2600 product family
(230 ns) vs. Intel® Xeon® processor 5500 series (340 ns). See notes in backup for configuration details
.2. Source: 8 GT/s and 128b/130b encoding in PCIe* 3.0 specification enables double the interconnect bandwidth over the PCIe* 2.0 specification
(www.pcisig.com/news_room/November_18_2010_Press_Release/).
with Intel® Integrated I/O

12
INTEL CONFIDENTIAL

Intel® Xeon® processor E5-2600 v2 Product Family
Intel Xeon Processor
E5-2600 v2

Socket compatible replacement
for Intel® Xeon® processor
E5-2600 product family
Up to 12 cores and 30MB
cache expected to deliver up to
50%1 more performance in
same power envelope

Up to 30MB
Shared Cache

4 channels of up
To DDR3 1866
MHz memory


Integrated
PCI
Express*
3.0
Up to 40
lanes
per socket

Improved security with Intel®
Secure Key & Intel® OS Guard
for additional HW embedded
security

1 1Baseline Configuration and Score on SPECVirt_sc2013* benchmark. Please contact your Intel representative to obtain Intel’s current plan of record product roadmaps. Software
and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are
other information and performance tests to assist you in fully evaluating your contemplated purchases,
including the performance of that product when combined with other products.
For more information go to http://www.intel.com/performance

13
INTEL CONFIDENTIAL

World Record Performance
• E5-2600 v2 featured in the #1 supercomputer “Milky Way-2” on the
Top500 list
• With 12 cores running up to 2.7 GHz, E5-2600 v2 delivers 259 GFlops
per socket, a 56% increase over the previous generation
• E5-2600 v2 also in 2 other supercomputers on the Top500 list - #54
and #329

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using
specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to
assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
14

Source: http://newsroom.intel.com/community/intel_newsroom/blog/2013/06/17/intel-powers-the-worlds-fastest-supercomputer-reveals-new-and-future-high-performance-computing-technologies

LGA2011 (E5)

Advanced
 8C-20MB,
10C-25MB cache
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866 (skt R)
 DDR3-1600 (skt B2)
 Intel® Turbo Boost
Technology

10C
3.0GHz

E5-2690 v2

10C
2.8GHz

E5-2680 v2

10C
2.5GHz
10C
2.2GHz

130W

 6C-15MB,
8C-20MB cache
 7.2 GT/s QPI
 Intel® HT
Technology
 DDR3 1600
Technology

Basic
 4C-10MB,
2C-5MB cache
 6.4 GT/s QPI
 DDR3 1333

Segment
Optimized

115W
115W
E5-2670 v2

95W
E5-2660 v2

8C
2.6GHz

Standard

LGA2011 (E5)

E5-2650 v2

8C
2.0GHz

150W
E5-2687W v2

8C
130W
3.3GHz 25M E5-2667 v2 T
6C
130W
3.5GHz 25M E5-2643 v2 T

6C
2.1GHz

4C
130W
3.5GHz 15M E5-2637 v2

95W
80W
E5-2630 v2

80W
E5-2620 v2

4C
2.5GHz

E5-2609 v2

4C
1.8GHz

2.5MB/c cache
10C 8.0 GT/s QPI
6C 7.2 GT/s QPI
DDR3-1600
Intel® HT
Technology
Technology






80W

E5-2603 v2

80W

T Tray only SKUs
15
15

8C
3.4GHz

E5-2640 v2

6C
2.6GHz

95W

 2.5MB/c cache
More cache as noted
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866
Technology

12C
130W
2.7GHz 30M E5-2697 v2
12C
115W
2.4GHz 30M E5-2695 v2

INTEL CONFIDENTIAL

Low Power
70W

T

10C
1.7GHz

E5-2650L v2

6C
2.4GHz

E5-2630L v2

60W

T

Workstation
Only SKU

LGA2011 (E5)

Advanced
 8C-20MB,
10C-25MB cache
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866 (skt R)
 DDR3-1600 (skt B2)
Technology

10C
3.0GHz

E5-2690 v2

10C
2.8GHz

E5-2680 v2

10C
2.5GHz
10C
2.2GHz

130W

 6C-15MB,
8C-20MB cache
 7.2 GT/s QPI
 Intel® HT
Technology
 DDR3 1600
Technology

Basic
 4C-10MB,
2C-5MB cache
 6.4 GT/s QPI
 DDR3 1333

Segment
Optimized

115W
115W
E5-2670 v2

95W
E5-2660 v2

8C
2.6GHz

Standard

LGA2011 (E5)

E5-2650 v2

8C
2.0GHz

150W
E5-2687W v2

8C
130W
3.3GHz 25M E5-2667 v2 T
6C
130W
3.5GHz 25M E5-2643 v2 T

6C
2.1GHz

4C
130W
3.5GHz 15M E5-2637 v2

95W
80W
E5-2630 v2

80W
E5-2620 v2

4C
2.5GHz

E5-2609 v2

4C
1.8GHz

2.5MB/c cache
10C 8.0 GT/s QPI
6C 7.2 GT/s QPI
DDR3-1600
Intel® HT
Technology
Technology






80W

E5-2603 v2

80W

T Tray only SKUs
16
16

8C
3.4GHz

E5-2640 v2

6C
2.6GHz

95W

 2.5MB/c cache
More cache as noted
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866
Technology

12C
130W
2.7GHz 30M E5-2697 v2
12C
115W
2.4GHz 30M E5-2695 v2

INTEL CONFIDENTIAL

Low Power
70W

T

10C
1.7GHz

E5-2650L v2

6C
2.4GHz

E5-2630L v2

60W

T

Workstation
Only SKU

LGA2011 (E5)

Advanced
 8C-20MB,
10C-25MB cache
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866 (skt R)
Technology

10C
3.0GHz

E5-2690 v2

10C
2.8GHz

E5-2680 v2

10C
2.5GHz
10C
2.2GHz

130W

 6C-15MB,
8C-20MB cache
 7.2 GT/s QPI
 Intel® HT
Technology
 DDR3 1600
Technology

Basic
 4C-10MB,
2C-5MB cache
 6.4 GT/s QPI
 DDR3 1333

Segment
Optimized

115W
115W
E5-2670 v2

95W
E5-2660 v2

8C
2.6GHz

Standard

LGA2011 (E5)

E5-2650 v2

8C
2.0GHz

150W
E5-2687W v2

8C
130W
3.3GHz 25M E5-2667 v2 T
6C
130W
3.5GHz 25M E5-2643 v2 T

6C
2.1GHz

4C
130W
3.5GHz 15M E5-2637 v2

95W
80W
E5-2630 v2

80W
E5-2620 v2

4C
2.5GHz

E5-2609 v2

4C
1.8GHz

2.5MB/c cache
10C 8.0 GT/s QPI
6C 7.2 GT/s QPI
DDR3-1600
Intel® HT
Technology
Technology






80W

E5-2603 v2

80W

T Tray only SKUs
17
17

8C
3.4GHz

E5-2640 v2

6C
2.6GHz

95W

 2.5MB/c cache
More cache as noted
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866
Technology

12C
130W
2.7GHz 30M E5-2697 v2
12C
115W
2.4GHz 30M E5-2695 v2

INTEL CONFIDENTIAL

Low Power
70W

T

10C
1.7GHz

E5-2650L v2

6C
2.4GHz

E5-2630L v2

60W

T

Workstation
Only SKU

LGA2011 (E5)

Advanced
 8C-20MB,
10C-25MB cache
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866 (skt R)
Technology

10C
3.0GHz

E5-2690 v2

10C
2.8GHz

E5-2680 v2

10C
2.5GHz
10C
2.2GHz

130W

 6C-15MB,
8C-20MB cache
 7.2 GT/s QPI
 Intel® HT
Technology
 DDR3 1600
Technology

Basic
 4C-10MB,
2C-5MB cache
 6.4 GT/s QPI
 DDR3 1333

Segment
Optimized

115W
115W
E5-2670 v2

95W
E5-2660 v2

8C
2.6GHz

Standard

LGA2011 (E5)

E5-2650 v2

8C
2.0GHz

150W
E5-2687W v2

8C
130W
3.3GHz 25M E5-2667 v2 T
6C
130W
3.5GHz 25M E5-2643 v2 T

6C
2.1GHz

4C
130W
3.5GHz 15M E5-2637 v2

95W
80W
E5-2630 v2

80W
E5-2620 v2

4C
2.5GHz

E5-2609 v2

4C
1.8GHz

2.5MB/c cache
10C 8.0 GT/s QPI
6C 7.2 GT/s QPI
DDR3-1600
Intel® HT
Technology
Technology






80W

E5-2603 v2

80W

T Tray only SKUs
18
18

8C
3.4GHz

E5-2640 v2

6C
2.6GHz

95W

 2.5MB/c cache
More cache as noted
 8.0 GT/s QPI
 Intel® HT
Technology
 DDR3-1866
Technology

12C
130W
2.7GHz 30M E5-2697 v2
12C
115W
2.4GHz 30M E5-2695 v2

INTEL CONFIDENTIAL

Low Power
70W

T

10C
1.7GHz

E5-2650L v2

6C
2.4GHz

E5-2630L v2

60W

T

Workstation
Only SKU

Intel® Xeon® Processor

Neusoft CT

Intel® Advance Vector Extensions – Float 16
“The Intel Xeon Processor E5-2600 V2 generates complex CT images about
45 percent faster than the previous Intel Xeon Processor E5-2600. A study
that took 20 minutes can now be completed in just 11. Multiply that by the
hundreds of patients in a busy clinic and the time savings stretch to hours
per day. We also see performance gains of up to 1.54X using Float16
Instructions for select workloads. This is absolutely a preferred hardware
platform for Neusoft CT.”

www.neusoft.com

Intel AVX
The Higher the Better

Shuangxue Li, Vice President of Neusoft Medical Systems Co.,
Ltd., General Manager of Diagnostic Imaging Systems Division

1.80

 Neusoft CT scanners depend, in part, on the efficiency of the
underlying image-generation software and its ability to deliver
high quality images quickly.
 Benefits of the Intel® Xeon® processor E5 v2 family—Fast image
generation reduces wait times for patients and medical teams in
busy clinical settings.

Intel® AVX reduces the diagnosis latency,
and helps doctors to make the right decision in the
shortest time

1.60

On Intel®
Xeon®
Processor E52600 V2
series without
AVX Float 16
Optimization

1.54X

1.40
1.20
1.00
0.80

On Intel®
Xeon®
Processor E52600 V2
series with
AVX Float 16
Optimization

0.60
0.40
0.20
0.00

19
INTELINTEL CONFIDENTIAL UNDER NDA ONLY UNLESS TAGGED “PUBLIC AT LAUNCH”.
CONFIDENTIAL - USE

*Other names and brands may be claimed as the property of others


SunGard ALM Benchmark 5.8.6
Risk Analytics

www.sungard.com

“Having successfully migrated to Intel® Xeon® E5-2600 v2, we have seen
significant increases in processing power. We have run the large scenario
simulation engine that is able to take advantage of the increased number
of cores in the new Intel platform; the new platform increased our
performance by more than 38%. These improved results come at a time
when our customers are demanding faster results with even greater
granularity.”

80

Joe Sass, Director of Product Strategy for SunGard’s Ambit ALM business

70

Finance
Elapsed time in sec

60

1.38x Faster

50

 SunGard’s Asset & Liability Risk Management solution provides
complete multidimensional analysis of the balance sheet,
incorporating interest rate risk, income simulation and market
valuation using deterministic and stochastic modeling.

40
30
20
10

Better Information and Analysis Means Better Decisions.
SunGard ALM Risk Management Solutions

0
Intel® Xeon®
processorE5-2600

Intel® Xeon®
processor E5-2600 V2

20
CONFIDENTIAL - USE



Paradigm GeoDepth* v2011.3
Seismic Imaging

“Our continued investment in the optimization of the GeoDepth software,
leveraging the Intel compliers and the Intel MKL library, enables our
customers to take immediate advantage of the 50% increase in compute
cores in this latest generation of Intel Xeon processors.” Duane Dopkin,
Executive Vice President, Technology.”

www.paradigm.com

ENERGY

Duane Dopkin, Senior Vice President, Technology

 Customer Benefits—Geophysicists can choose to apply the scalable
performance improvements to produce higher resolution images of the
subsurface, or to improved throughput of their existing workload.

1.45

1.59

12 core Intel® Xeon® processor E5-2697 V2

CSFWMIG Benchmark

1

 Key Intel® Xeon® processor E5 v2 advantage—Increased memory speed
reduces communications overhead; 24-cores per two-socket server provides
application scalability; Intel® Hyper-Threading Technology and Intel® Turbo
Boost Technology provide much higher price performance.

8 core Intel® Xeon® processor E5-2670

1

 GeoDepth* is the leading system for 3D and 2D velocity model building and
seismic imaging in time and depth. Through the integration of interpretation,
velocity analysis, model building, model updating, model validation, depth
imaging and time-to-depth conversion, GeoDepth provides the continuity
needed to produce high-quality, interpretable images consistent with other
available data.

Paradigm 2011.3 Benchmarks
Relative Performance Higher is better

CRAM Benchmark

Scalable performance for high resolution seismic imaging
21
CONFIDENTIAL - USE



Star-CCM+*

Engineering Analysis (Multi-Disciplinary)
“We redesigned the front end of our chassis almost exclusively using
simulations with CD-adapco software, the redesign added about 50 lbs.
of down force which is enough extra grip to give us about a tenth of a
second a lap.”

www.cd-adapco.com

HPC

Andy Hogg, Aerodynamics manager, Michael Waltrip Racing

 CD-adapco STAR-CCM+* provides comprehensive support for solving
complex engineering problems involving flow (of fluids or solids), heat
transfer and stress. It helps engineers automate workflows to perform
iterative design studies with minimal user interaction.
 Faster simulation runtimes reduce simulation/prototyping timelines, to
improve design quality, and speed time to market.
 Increased memory bandwidth of the E5-2600 v2 series allows better
utilization of its computational resources, significantly improving
run times.

Faster performance; High quality digital cinema;
Faster time to Market

STAR-CCM+ 8.04.007
Lemans 17M
Iteration time, sec - lower is better
20.000
18.000
16.000
14.000
12.000
10.000
8.000
6.000
4.000
2.000
0.000

17.7
13.0

Sandy Bridge
8-core @ 2.7
GHz

Ivy Bridge
10-core @ 2.8
GHz

22
CONFIDENTIAL - USE


1.53x
Faster
11.5

Ivy Bridge
12-core * 2.7
GHz

Intel® Xeon Phi™
Co-processor Update

23

INTEL CONFIDENTIAL

PARALLELISM IS THE PATH FORWARD
Intel is Your Roadmap

Most Commonly
Used Parallel Processor
• Performance and energy efficiency for
most workloads
• Parallel, Serial, Multicore + Vector
• Robust security and reliability
• Flexible foundation for growth
and innovation

24

Optimized for
Highly Parallel Application
• More cores and more threads per core
• Wider Vector instructions

• Higher memory bandwidth
• Common languages, directives,
libraries & tools
• Complements Intel® Xeon® processors

PRODUCT LINEUP

Intel® Xeon Phi™ Coprocessor

3xxx Family

Outstanding Parallel
Computing Solution
Performance/$ leadership

5xxx Family

Optimized for High Density
Environments

6GB GDDR5
240GB/s
>1TF DP
3120P

3120A

5110P

5120D

7120P

7120X

8GB GDDR5
>300GB/s
>1TF DP

Performance/watt leadership

225-245W

7xxx Family

16GB GDDR5

Highest Performance, Most
Memory
Performance leadership

352GB/s
>1.2TF DP

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components,
software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the
performance of that product when combined with other products. For more information go to http://www.intel.com/performance

25
25

BIG GAINS FOR PARALLEL APPLICATIONS

7.00

5.00

Performance
3.00
1.00

Efficient vectorization,
threading, and parallel
execution drives higher
performance for
many applications

0.80
1.00

0.60
0.40
0%
25%

% Vector

0.20
50%

* Theoretical acceleration using a highly-parallel Intel® Xeon Phi™ coprocessor
versus a standard multi-core Intel® Xeon® processor
26

0.00

75%
100%

Fraction Parallel

27

PARALLELIZING FOR HIGH PERFORMANCE
A Two Step Process

STARTING POINT
Typical serial code
running on multi-core
Intel® Xeon® processors

67.097

SECONDS

Current
Performance

STEP 1.

OPTIMIZE CODE
Parallelize and vectorize
code and continue to run on
multi-core Intel Xeon processors

STEP 2.

USE COPROCESSORS
Run all or part of the
optimized code on Intel® Xeon
Phi™ coprocessors

27

0.46

SECONDS

0.197

SECONDS

145X
FASTER

2.3X
FASTER

340X
FASTER

measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other
information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Source: Intel Measured results as of October 26, 2012 Configuration Details: Please reference slide speaker notes.
For more information go to http://www.intel.com/performance

Highly-parallel Processing for Unparalleled Discovery
Seamlessly solve your most important problems of any scale

Intel® Xeon Phi™
product family
Based on Intel® Many Integrated Core (Intel® MIC)
architecture
Leading performance for highly parallel workloads
Common Intel® Xeon® programming model seamlessly
increases developer productivity

Single Source

Launching on 22nm with >50 cores

Compilers
and Runtimes

Intel® Xeon® processor
Ground-breaking real-world application
performance
Industry-leading energy efficiency
Meet HPC challenges and scale
for growth

28
28

A GROWING ECOSYSTEM

Developing today on Intel® Xeon Phi ™ Co-processors

Shown at SC’12, November 2012
29

Other brands and names are the property of their respective owners.

PERFORMANCE PROOF POINT:
ENERGY INDUSTRY
Sinopec iCluster PSDM

“

Speedup
(Higher is Better)

This will provide an amazing boost for the
performance of the Sinopec iCluster seismic
imaging system.”
Zhao Gaishan

VP of Sinopec Geophysical Research Institute, November, 2012

6

5

5
4
3
2
1

1

1.06

0

• Application: Sinopec iCluster PSDM is a key module in the
Sinopec iCluster* seismic imaging system. The split step
fourier prestack depth migration (SSF PsDM) algorithm is
ideal for mild lateral velocity variations.
It provides one-way approximation with wave
propagation performed in the frequency domain.
• Status: In house code

•
•

•

2S Intel® Xeon® processor E5-2680

• Usage Model: Offload

(pre-production HW/SW)

• Demonstrated Results: Dramatic scaling (5.3x) over
baseline using two server nodes, each with two Intel®
Xeon® processors and two Intel® Xeon Phi™ coprocessors

2S Intel ® Xeon® processor E5-2680 +
2 Intel® Xeon Phi™ Coprocessor
Two node (pre-production HW/SW)

Code Optimization Strategies:
software.intel.com/en-us/articles/optimize-seismic-imaging-processing-on-intel-xeon-phi

30
30

SOURCE: INTEL RESULTS AS OF JULY, 2013

FINANCIAL SERVICES
Black-scholes formula valuation

• Application: Black-Scholes financial modeling requires
raw computational power plus high bandwidth
between
execution cores and memory

Speedup
(Higher is Better)

• Status: Case Study available

7

• Highlights: Dramatic scaling for both single- and
double-precision computations

5.81

6
5
4

2.85

3
2
1
0

•
•

1
Single Precision

1
Double
Precision

2S Intel Xeon processor E5-2670 +

Read the Case Study:

• Demonstrated Results:
• Intel® Xeon Phi™ coprocessor streaming store
provides optimized cache and bandwidth usage
• Intel Xeon Phi coprocessor fast transcendental
functions exp2(), log2() increase performance
and accuracy on SP
• Intel® Xeon® processors also benefit from using
exp2()/log2()
• Compiler based code generation enables plain
C++ code, which delivers higher
performance than vector intrinsics

software.intel.com/en-us/articles/case-study-achieving-superior-performance-on-black-scholes-valuation-computing-using

31
31

SOURCE: INTEL MEASURED RESULTS AS OF JULY, 2013

GOVERNMENT AND ACADEMIC RESEARCH
LRZ/TUM SG++

• Application: Extends MATLAB with a toolbox for
employing spatially adaptive sparse grids in a flexible,
modular way

Speedup
(Higher is Better)

• Status: not released yet

4.5

3.92

4

• Uses MPI, intrinsics, offload pragmas, and OpenMP

3.5
3

• Floating-point intensive and has a complex, non-linear
kernel

2.5
2
1.5

1

1
0.5
0
•

•

2S Intel Xeon processor E5-2670 +
2* Intel® Xeon Phi™ Coprocessors

32
32

• Workload Characteristics:

SOURCE: THIRD PARTY MEASURED RESULTS AS OF NOVEMBER, 2012

• Innermost loop contains an if statement for efficient
handling of high-dimensional grid boundaries
(reduces computational complexity)

- Demonstrated Results:
• Highlight: Performance scales well to four
Intel® Xeon Phi™ coprocessors per node
• Supports symmetric configurations with Intel® Xeon®
processors and Intel® Xeon Phi™ coprocessors

PERFORMANCE PROOF-POINT:
WEATHER AND CLIMATE RESEARCH
WRF v3.5

•

Application: Weather Research and Forecasting
(WRF)

•

Status: WRF V3.5 was released 4/18/13

•

Code Optimization:

Speedup
(Higher is Better)
1.6

1.4

• Approximately two dozen files with less than
2,000 lines of code were modified (out of
approximately 700,000 lines of code in about
800 files, all Fortran standard compliant)

1.4
1.2

1

1
0.8
0.6

• Most modifications improved performance for
both the host and the co-processors

0.4

0.2
0
•

•

Performance Measurements: Pre release of WRF
3.5 (V3.5Pre) and NCAR supported CONUS2.5KM
benchmark (a high resolution weather forecast)

•

Acknowledgments: There were many contributors
to these results, including the National Renewable
Energy Laboratory and The Weather Channel
Companies

2S Intel® Xeon® processor E5-2670 with
eight-node cluster configuration
2S Intel® Xeon® processor E5-2670 +
Intel® Xeon Phi™ coprocessor
with eight-node cluster configuration

33
33

•

SOURCE: INTEL MEASURED RESULTS AS OF JULY, 2013

Next Generation
Intel® Xeon Phi™ Product Family
(Codenamed Knights Landing)

 Available in Intel cutting-edge 14
nanometer process
 Stand alone CPU or PCIe coprocessor
– not bound by ‘offloading’
bottlenecks
 Integrated Memory - balances
compute with bandwidth

Parallel is the path forward - Intel is your roadmap
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

34
34

Note that code name above is not the product name

Intel® HPC Fabric Update

35

INTEL CONFIDENTIAL

Next Front of System Innovation: Fabrics
HPC Expertise
Fabric Management & Software
Highest Performance, Scalable IB
Products
HPC Expertise
Intellectual Property
World-class Interconnects

Low-latency Ethernet Switching
Data Center Ethernet Expertise
High Radix & Low Radix Switch
Products

Intel’s
Comprehensive
Connectivity and
Fabric
Portfolio

Market Leading Compute & Ethernet
Products
Platform Expertise

Unprecedented Rate of Innovation in HPC Fabric
36

Other brands and names are the property of their respective owners.

Intel® True Scale HPC Fabric
Key Differentiators
Connectionless
- Minimal on-adapter state
- No Chance of cache misses as the cluster/fabric scales
- Maintains low end-to-end latency, even at scale
PSM Layer
- Performance Scaled Messaging light weight interface between MPI (Message
Passing Interface) and the InfiniBand device driver
- High MPI message rate performance
- Excellent short message efficiency
- Collective performance at scale without requiring special/hardware
acceleration

37

The Advantages of Fabrics Integration

Intel®
Processor

32 GB/sec

Fabric
Controller

System IO Interface (PCIe)

10-20 GB/sec

Fabric Interface

Today

Problem:
• Power – System IO Interface Adds “10s Of Watts”
Incremental Power
• Cost & Density – More Components On A Server
Node
• Scalability – Processor Capacity & Memory
Bandwidth Scaling Faster Than System IO
Bandwidth
Solution:

Fabric Interface

Intel® Processor

100+ GB/sec

Fabric Controller

Tomorrow

• Removing The System IO Interface From The
Fabrics Solution Reducing Power
• An Integrated Fabrics Results In Fewer Components
On The Server Node
• An Integrated Fabric Balances Fabric and Compute
 Scaling Application Performance & Efficiency

Fabrics Integration Required to Scale Performance & Power
38

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