This document reviews digital image correlation (DIC) for deformation measurement using speckle patterns. DIC is a non-contact optical method that uses digital images of a speckle pattern on a surface before and after deformation. By comparing the speckle patterns in the images, DIC can determine displacement and strain fields with high accuracy. The document discusses speckle pattern types, the DIC process, related works that have improved DIC methods, and applications of DIC such as for high-temperature testing. DIC provides full-field measurements and greater accuracy compared to conventional contact methods.