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How to Build Hardware Lean
By Joo Aun Saw and Zoran Angelovski
YOW! Connected
Who we are?
Our background (combined): 
§  Telecoms, Smart Energy, IoT.
§  DiUS. 
§  Products. 
§  Current.
2
Our talk
3
$

Starter Kits / SBC
 Production
Module

Evaluation 
Module
NRE
Per Unit Cost
Chip Level
1 - 3
 3 - 10
 10 – 500(?)
 Prod
Building hardware
§  What you needed – yesterday.
§  How it was done – yesterday.
§  How it is done – today.
4
What you needed - yesterday
Capabilities: 
§  Specialist skills and tools.
What was ‘hardware’: 
§  Discrete → some level of integration. 
§  Complex PCB.
§  Equipment was expensive. 
Barriers were higher but still doable.
5
How it was done - yesterday
§  Assembling a prototype.
§  Bread board.
§  Your own PCB.
§  Buy parts.
§  Time consuming.

Barriers were higher but still doable.
6
How it is done - today
§  SoC’s, Eval Modules, Starter Kits
(+Breakout boards) and Prod
Modules.
§  Lower Cost and availability.
§  Tools and building.
Cypress PSoC® is the world's first
programmable embedded system-on-chip
integrating configurable analog and digital
peripheral functions
Arduino Uno Starter Kit 
7
Breakout Board
From concept to proof-of-value
§  What is available today?
§  Which approach and why?
§  Exploring opportunities. 
8
What is available today?
Open source kit, SBC → Custom design:
§  Arduino, Rasp Pi with breakout boards.
§  Evaluation modules (most chip vendors).
§  Schematic and layout (Eagle, KiCAD).
§  Parts (Digi-Key, Mouser, Element14).
§  PCB (OshPark). 
§  Mechanical - print your own. 
9
Leverage specialists
Engage partners directly and indirectly:
§  Industrial design.
§  RF / analogue circuit.
§  Dangerous voltages (240V). 
…leverage your partners’ expertise.
10
Which approach and why?
ESI / IoT gateway: 
§  Proof-of-Value. 
§  Direct to PCB.
§  Mechanical.

PowerVu:
§  Why did we choose a partner? 
§  Specialist hardware, industrial design. 
11
Exploring opportunities
Project: 
Multispectral Imaging for Agriculture
Status: 
Proof-of-Concept 

§  Minimised commitment.
§  Proof-of-Value.
§  Business case.
12
Experimenting with hardware
Over to Joo…
§  Different levels of experimentation.
§  Before you start.
§  Case study.
§  Issues to consider.
13
Different levels of hardware
experimentation
14
Before you start
Consider:
§  Why, what, where?
§  How many?
§  Tools?
§  Skills?
§  Software stack and licensing? 
15
$

NRE
Per Unit Cost
Multispectral imager
Low cost high resolution multispectral imager.
Challenges:
§  First airborne device, inexperience.
§  Unproven hardware and software.
§  Size and weight constraints.
§  Difficult to test (highly dependent on weather).
16
Multispectral imager (the lean way)
§  Defer custom PCB.
§  Don’t reinvent the wheel.
§  Iterate.
§  Test cycles.
§  UX (User Experience).
1st prototype:
3rd prototype:
17
Issues to consider
Experimentation
 Production
Work Environment – smells and fumes,
noise, common sense – 240V.
ü
ü
Certification - ZigBee, USB, Wi-Fi.
 ? ü
 ü
Safety and Regulatory - EMC, RCM
(regulatory compliance mark), CASA
certificate.
?
 ü
Parts - EoL, hard to get, changes in spec.
 ü
 ü
18
Lastly…
§  Some words about manufacturing.
§  What’s the opportunity for business?
19
Experimenting à Manufacturing
Here you have to do more that just the fun stuff… 

…get the factory and partners involved early
20
Process 
Regulatory
approvals
Leadtimes
Procurement 
Records
Revision control 
Components 
Changes
Alternative Parts
Warranty
What’s the opportunity for business?
§  Explore Opportunities. 
§  Our brand.
§  Consultancy service. 
§  Dedicated development team.
§  Product range.
21
DiUS product range
22
Smart Energy
ChargeIQ 
Smart Energy ESI
(Software)
Sensor / IoT
Local Smoke Alert
Presentation
Cloud Based Data Service
LiveVu
Get in touch
e. zangelovski@dius.com.au
e. jasaw@dius.com.au
@dius_au
Linkedin.com/company/dius-computing
23

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How to Build Hardware Lean

  • 1. How to Build Hardware Lean By Joo Aun Saw and Zoran Angelovski YOW! Connected
  • 2. Who we are? Our background (combined): §  Telecoms, Smart Energy, IoT. §  DiUS. §  Products. §  Current. 2
  • 3. Our talk 3 $ Starter Kits / SBC Production Module Evaluation Module NRE Per Unit Cost Chip Level 1 - 3 3 - 10 10 – 500(?) Prod
  • 4. Building hardware §  What you needed – yesterday. §  How it was done – yesterday. §  How it is done – today. 4
  • 5. What you needed - yesterday Capabilities: §  Specialist skills and tools. What was ‘hardware’: §  Discrete → some level of integration. §  Complex PCB. §  Equipment was expensive. Barriers were higher but still doable. 5
  • 6. How it was done - yesterday §  Assembling a prototype. §  Bread board. §  Your own PCB. §  Buy parts. §  Time consuming. Barriers were higher but still doable. 6
  • 7. How it is done - today §  SoC’s, Eval Modules, Starter Kits (+Breakout boards) and Prod Modules. §  Lower Cost and availability. §  Tools and building. Cypress PSoC® is the world's first programmable embedded system-on-chip integrating configurable analog and digital peripheral functions Arduino Uno Starter Kit 7 Breakout Board
  • 8. From concept to proof-of-value §  What is available today? §  Which approach and why? §  Exploring opportunities. 8
  • 9. What is available today? Open source kit, SBC → Custom design: §  Arduino, Rasp Pi with breakout boards. §  Evaluation modules (most chip vendors). §  Schematic and layout (Eagle, KiCAD). §  Parts (Digi-Key, Mouser, Element14). §  PCB (OshPark). §  Mechanical - print your own. 9
  • 10. Leverage specialists Engage partners directly and indirectly: §  Industrial design. §  RF / analogue circuit. §  Dangerous voltages (240V). …leverage your partners’ expertise. 10
  • 11. Which approach and why? ESI / IoT gateway: §  Proof-of-Value. §  Direct to PCB. §  Mechanical. PowerVu: §  Why did we choose a partner? §  Specialist hardware, industrial design. 11
  • 12. Exploring opportunities Project: Multispectral Imaging for Agriculture Status: Proof-of-Concept §  Minimised commitment. §  Proof-of-Value. §  Business case. 12
  • 13. Experimenting with hardware Over to Joo… §  Different levels of experimentation. §  Before you start. §  Case study. §  Issues to consider. 13
  • 14. Different levels of hardware experimentation 14
  • 15. Before you start Consider: §  Why, what, where? §  How many? §  Tools? §  Skills? §  Software stack and licensing? 15 $ NRE Per Unit Cost
  • 16. Multispectral imager Low cost high resolution multispectral imager. Challenges: §  First airborne device, inexperience. §  Unproven hardware and software. §  Size and weight constraints. §  Difficult to test (highly dependent on weather). 16
  • 17. Multispectral imager (the lean way) §  Defer custom PCB. §  Don’t reinvent the wheel. §  Iterate. §  Test cycles. §  UX (User Experience). 1st prototype: 3rd prototype: 17
  • 18. Issues to consider Experimentation Production Work Environment – smells and fumes, noise, common sense – 240V. ü ü Certification - ZigBee, USB, Wi-Fi. ? ü ü Safety and Regulatory - EMC, RCM (regulatory compliance mark), CASA certificate. ? ü Parts - EoL, hard to get, changes in spec. ü ü 18
  • 19. Lastly… §  Some words about manufacturing. §  What’s the opportunity for business? 19
  • 20. Experimenting à Manufacturing Here you have to do more that just the fun stuff… …get the factory and partners involved early 20 Process Regulatory approvals Leadtimes Procurement Records Revision control Components Changes Alternative Parts Warranty
  • 21. What’s the opportunity for business? §  Explore Opportunities. §  Our brand. §  Consultancy service. §  Dedicated development team. §  Product range. 21
  • 22. DiUS product range 22 Smart Energy ChargeIQ Smart Energy ESI (Software) Sensor / IoT Local Smoke Alert Presentation Cloud Based Data Service LiveVu
  • 23. Get in touch e. [email protected] e. [email protected] @dius_au Linkedin.com/company/dius-computing 23