This document discusses various mechanisms for breakdown in solid dielectric materials. It describes intrinsic breakdown, which occurs at very high electric fields and depends on free electrons in the material. Electromechanical breakdown occurs when electrostatic forces exceed the material's mechanical strength. Breakdown can also be caused by treeing and tracking, where spark channels spread and form conductive paths. Thermal breakdown results from heat generated by dielectric losses exceeding heat dissipated from the material. Electrochemical breakdown involves chemical reactions like oxidation and hydrolysis that degrade insulating properties.