OMI - The Missing Piece of a Modular, Flexible and Composable Computing World
0 likes309 views
The document discusses the Open Memory Interface (OMI) and its role in facilitating disaggregated, flexible, and composable computing by allocating resources effectively for varying workloads. It covers concepts such as rack-scale disaggregation, the importance of modular architecture, and the benefits of OMI in improving memory bandwidth while maintaining low latency. The document also highlights practical implementations and configurations of OMI in different computing modules, emphasizing the advances in memory technology and its applications.
OMI - The Missing Piece of a Modular, Flexible and Composable Computing World
- 1. Allan Cantle - 3/25/2021 [email protected] OMI - Open Memory Interface The Missing Piece of a Disaggregated Modular, Flexible & Composable Computing World
- 2. Ethernet or PCIe with future support for CXL Resources are allocated & managed with composer software, allocating appropriate resources to each virtual machine driven Workload What is Disaggregation? An attempt to free up Stranded Resources for di ff ering Workloads Disaggregating Local DDR Memory into Memory Pools has proven to be more challenging . Latency Critical . RAS Issues A A A A A A A A C C C C C C C C M M M M M M M M S S S S S S S S IO IO IO IO IO IO IO IO Rack Scale Disaggregation S C M M M C IO IO A S S S S S S S Classic Server with a Typical Converged Infrastructure A IO M = Memory = Accelerator = Input/Output C = Compute S = Storage • Downsides of Rack Scale Disaggregation • Increased Power through more data movement • Increased stress on Network in order to enable software composability Focus of this Webinar
- 3. C C C C M M M M What is Disaggregation? An attempt to free up Stranded Resources for di ff ering Workloads A A A A A A A A M M M M S S S S S S S S IO IO IO IO IO IO IO IO Rack Scale Disaggregation S C M M M C IO IO A S S S S S S S Classic Server with a Typical Converged Infrastructure A IO M = Memory = Accelerator = Input/Output C = Compute S = Storage Focus of this Webinar C C C C Memory Inception over OpenCAPI Thymesis Flow
- 4. Why do Workloads differ in resource needs? Di ff ering Compute ratios - Ops : Bytes/sec : Bytes Capacity Workload Type Processor Centric Balanced (Classic) Data Centric Compute Ratio 100 : 1 : 0.01 1 : 1 : 1 0.01 : 1 : 100 Architectural Example M = HBM M = DRAM A M C M S S S S S C S IO IO IO S If you Compose a Computer to Application A’s exact needs ——> you now have a “Domain Speci f ic Architecture” Building Application A’s exact architecture requires Modularity, Flexibility & Composability EVERYWHERE IO IO Algo 1 100 : 1 : 0.01 Algo 2 1 : 1 : 1 Algo 3 0.01 : 1 : 100 Algo 4 100 : 1 : 0.01 Applications often have di ff ering workload Algorithms running in parallel with di ff ering IO bandwidth between them IO IO IO IO IO Application A The Compute Ratio Hierarchically repeats itself in a Fractal like manner IO
- 5. Disaggregation without the Downsides Physically Modular, Flexible and Composable IO IO Algo 1 100 : 1 : 0.01 Algo 2 1 : 1 : 1 Algo 3 0.01 : 1 : 100 Algo 4 100 : 1 : 0.01 IO IO IO IO IO IO Application A • Lego Block construction of Compute Ratios at the system level • Domain Speci f ic Implementations could be quickly con f igured and tested • Dense Modularity & Distributed Computing minimize data movement power
- 6. Disaggregation without the Downsides Physically Modular, Flexible and Composable Application A • Lego Block construction of Compute Ratios at the system level • Domain Speci f ic Implementations could be quickly con f igured and tested • Dense Modularity & Distributed Computing minimize data movement power
- 7. DDR a Parallel Interface in Serial World Unsuitable for physically Composable Systems • Network, Memory, Media modules & IO use Common Serial EDSFF Interconnect OCP - NIC 3.0 SNIA - E1.S & E3.S Typically < 100W S IO OMI DDIMM M IO M DDR DIMM
- 8. OMI DDIMM Overview OMI O ff ers far more than just Composability • <10ns Latency Adder over a standard DDR4 RDIMM • In production since mid 2019 from Samsung, Smart Modular & Micron • Memory Technology Agnostic - e.g. Easy processor migration from DDR4 to DDR5 • Up to 8x more memory bandwidth per processor - (2x BW/DDIMM + 4x No. Channels) • Ecosystem Enablement with FPGA Host and Buffer Bringup Platform • Fully Open Sourced IP for Host Controller and OMI Memory Buffer (RTL in Github) • Functional and Memory Traf f ic Generator IP for testing purposes 16GB / 32GB - 1U High 64GB - 2U High 128GB - 3U High 32GB 3200 DDR4 DIMM (reference) OMI DDIMMs Formats 8 Industry Standard DDR4 Channels 8 OMI Channels (Equivalent Pin Comparison) Apollo - FPGA Host Controller Bringup Platform Gemini - OMI DDIMM with FPGA Bu ff er
- 9. IBM - POWER10 Die The OMI Advantage Memory Bandwidth AND Capacity at LOW Cost To Scale = 20pts : 1mm AMD - EPYC Rome IO Die 4x (2x2) DDR4 3200 DIMM Channels = 102GBytes/s 8x (8x1) OMI 25G DDIMM Channels = 400GB/s 8x (8x1) OMI 25G DDIMM Channels = 400GB/s 1x HBM2 8x (8x1) Channels = 311GB/s HBM2 HBM2 HBM2 HBM2 HBM2 HBM2 NVidia - Ampere Die
- 10. Fully Composable Compute Node Module Leveraged from OCP’s OAM Module - nicknamed OAM - HPC • FPGA Main Processor Example • supports many composable Memory / Storage / IO con f igurations 22x 2C Connectors For Memory, Storage &/or IO Xilinx VU37P or VU13P OAM - HPC Module Top View EDSFF TA - 1002 Interconnect OAM - HPC Module Bottom View OAM - HPC Module Bottom View with many IO, Memory & Media Con f igurations
- 11. IBM POWER 10 OAM - HPC Module Leveraged from OCP’s OAM Module - nicknamed OAM - HPC • Form Factor con f igurable for IBM POWER 10 Processor • Already supports the composable OMI DDIMM • Cabled IO for OpenCAPI, SMP, and/or PCIe 22x 2C Connectors For Memory, Storage &/or IO IBM POWER 10 OAM - HPC Module Top View EDSFF TA - 1002 Interconnect OAM - HPC Module Bottom View OAM - HPC Module Bottom View Populated with 16x OMI DDIMMs + Cabled IO
- 12. Memory Pooling Example Con f iguration Pluggable into OCP OAI Chassis
- 13. Thank you Want to f ind out more about OMI or the OAM - HPC Module? Please contact Allan Cantle at [email protected]