Plasma Asher Plasma Descum AW-105R
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The AW-105R from Allwin21 Corp. is a single-wafer automated plasma asher and descum tool designed for high-volume wafer fabrication, featuring key capabilities like integrated robotic handling, isotropic removal, and consistent process repeatability. It accommodates various wafer sizes up to 6.25 inches and operates within a temperature range of 60-250°C. The system includes advanced software for real-time monitoring, recipe management, and precise process control, alongside optional features such as endpoint detection and GEM/SECS II compatibility.
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Plasma Asher Plasma Descum AW-105R
- 1. Plasma Asher Descum ALLLWIN21 CORP. Introduction E-mail: [email protected] Website: www.allwin21.com AW-105R The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology. AW-105R Key Features Production-proven plasma Asher/Descum system. Integrated solid robotic wafer handling, Single wafer process. Up to 3%-5% Uniformity. Best for III-V Materials. Frontside and backside isotropic removal. Consistent wafer-to-wafer process cycle repeatability. Element heating for up to 250o C. 50mm-150mm wafer capability. Up to 6.25” substrate. Up to 4 wafer size capability without hardware change. Fixed cassette station and wafer aligner/cooling station. Can handle 50um thickness wafer. PC controller with Advanced Allwin21 Software. Endpoint detection (EOP) with Allwin21 SLOPE technology (Optional). Up to 3 gas lines with MFC. Air-Cooled 600W MKS 13.56 MHz RF Generator (300W Option). Pressure control with Throttle Valve. 15-inch Touch screen monitor GUI. EMO, Interlocks, and Watchdog function. GEM/SECS II (optional). Small Footprint: 27”W x 40”D x 59”H (280LBs) Made in U.S.A. AW-105R Applications GaAs, InP, GaN, SiC wafer Strip (Mainly) GaAs, InP, GaN, SiC wafer Descum (Mainly) Thin Film Head Resist Cleaning Opto-Electronic Devices Cleaning MEMS Photoresist Stripping High dose implant (As+ , B+ , P+ ) Rework Post-polysilicon Post-metal Post-oxide Controlled Resist Removal Post-develop descum Uniformity capability (<5% 1σ) Production-proven Reactor Integrated Robust Solid Robot Introduction Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10
- 2. Plasma Asher Descum ALLLWIN21 CORP. Branson/IPC 3000 Specifications* Allwin21 Corp. Address: 220 Cochrane Circle, Morgan Hill,CA95037, U.S.A. Tel.: +1-408-778-7788 Fax: +1-408-904-7168 Email: [email protected] All specification and information here are subject to change without notice and cannot be used for purchase and facility plan. AW-105R Software Key Features o Real time graphics display, process data acquisition, and analysis. o Closed-loop process parameters control. o Precise parameters profiles tailored to suit specific process requirements. o Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results. o Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber. o Validation of the recipe so improper control sequences will be revealed. o Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time. o Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions. o Simple and easy to use menu screen which allow a process cycle to be easily defined and executed. o Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”. o DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable. o The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored. o GEM/SECS II function (Optional). o Advanced Allwin21 End of Process (EOP) function (Optional) AW-105R Specifications* Wafer Size: Up to 6.25 inch. Temperature: 60-250ºC (±2ºC) Gas Lines: Up to three gas lines with MFCs. Typical MFC configuration: 5 SLM O2 and 500 SCCM N2. Asher Rate: 0.5-1.5 um/min at 200 to 250 ºC, bulk strip; 600 A/min at 100 ºC, Descum Uniformity: <±8% (Max-Min) Strip; <±5% (Max-Min) Descum Particulate: <0.05 /cm2 (0.03um or greater) Damage: CV:<0.1V from control; Mobile Ion:<1-2 E10 ; Vt :0% total shift on 98% of points tested no shift >5% Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime *Contact Allwin21 sales for other applications and specifications AW-105R Configuration Main Frame with Circuit Breakers, Solenoid Valves Pentium Class PC with AW Software Keyboard, Mouse, USB SW backup, and Cables Chuck /w Heat, Pump Ring ,Lift Pins ① 2-4 inch; ② 2-6 inch; ③ 4-6 inch; ④ 6.125 inch; ⑤ 6.25 inch Center Aligner and Cassette Station ① Two Dimensions ② Four Dimensions Anodized Reactor with Door Chamber Base plate with water sensor Base Plate and Reactor Ceramic Ring Base Plate and Chuck Ceramic Ring Upper and Lower Electrodes Quartz showerhead & Diffusion Disk Main Control and Distribution PCBs 3-axis Integrated Robust Solid Robot RF Matching Network with PCBs 13.56MHz RF Generator ① 300W ② 600W MFC /w In-line Filter and Solenoid Isolation Valve ① One MFC; ② Two MFCs; ③ Three MFCs AC/DC Box with Temperature Controller MKS Baratron with Isolation Valve Lamp Tower Alarm w/ Buzzer Throttle Valve Main Vacuum Valve Front EMO, Interlocks 15-inch Touch Screen GUI Options: End-of-Process (EOP) GEM/SECS II (Software) Vacuum Pump Chiller for Chamber Base Plate AW-105R Facilities RequirementsPlumbed Process Gases: O2 N2 Cooling water: 1GPM house circulating supply @ <23 ± 2°C Facility Exhaust: 100 CFM @ 1” static pressure Vacuum supply for Robot: 11.8”Hg(-5.8psi) / 0.1CFM airflow Power: 190-240VAC, single phase, 30A, 50/60Hz (NEMA L-6-30P plug supplied) Main Menu Screen